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AMD Am2901ADM

BSP » 2901 family » AMD » Am2901ADM

BSP Information

General information
Type	Bit Slice Processor
Package	40-pin ceramic DIP

Architecture / Microarchitecture
Die size	3.35 x 3.78 mm²
Data width	4 bit
Features	MIL-STD-883, Class C screening

Electrical/Thermal parameters
V core (V) ?	5 ± 10%
Min/Max operating temperature (°C) ?	-55 - 125
Typical/Max power dissipation (W)	0.8 / 1.54

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Last modified: 6 Nov 2008


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