| General information |
| Type | CPU / Microprocessor |
| Family | VIA C3 Samuel2 |
| CPU part number | C3-667AMHz EBGA |
| Frequency (MHz) ? | 667 |
| Bus speed (MHz) ? | 133 |
| Clock multiplier ? | 5 |
| Package | 368-ball enhanced BGA
1.38" x 1.38" (3.5 cm x 3.5 cm) |
| |
| Architecture / Microarchitecture |
| Processor core | Samuel 2 |
| Manufacturing process | 0.15 micron CMOS technology |
| Die size | 52 mm2 |
| Data width | 32 bit |
| Floating Point Unit | Integrated, running at 1/2 speed |
| Level 1 cache size ? | 64 KB 4-way associative code cache
64 KB 4-way associative data cache |
| Level 2 cache size ? | 4-way 64 KB exclusive unified (code and data) cache |
| Features | - MMX technology
- 3DNow! Technology
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| |
| Electrical/Thermal parameters |
| V core (V) ? | 1.6 |
| Minimum/Maximum operating temperature (°C) ? | 0 - 70 |
| Minimum/Typical/Maximum power dissipation (W) | 1.07 (Sleep mode) / 6 / 10.1 |
| |
| Notes on VIA C3-667AMHz EBGA |
- Clock multiplier is locked in non-"S" versions
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