| General information |
| Type | CPU / Microprocessor |
| Family | VIA C3 Samuel |
| CPU part number | C3-667MHz |
| Frequency (MHz) ? | 667 |
| Bus speed (MHz) ? | 133 |
| Clock multiplier ? | 5 |
| Package | 370-pin ceramic PGA
1.95" x 1.95" (4.95 cm x 4.95 cm) |
| Socket | Socket 370 |
| |
| Architecture / Microarchitecture |
| Processor core | Samuel |
| Manufacturing process | 0.18 micron CMOS technology |
| Die size | 75 mm2 |
| Data width | 32 bit |
| Floating Point Unit | Integrated |
| Level 1 cache size ? | 64 KB 4-way associative code cache
64 KB 4-way associative data cache |
| Features | - MMX technology
- 3DNow! Technology
|
| Low power features | - Auto-HALT power down state
- Stop grant state ?
- Sleep state ?
- Deep sleep state ?
|
| |
| Electrical/Thermal parameters |
| V core (V) ? | 1.9
2 |
| Minimum/Maximum operating temperature (°C) ? | 0 - 70 |
| Minimum/Typical/Maximum power dissipation (W) | 1.4 (Sleep mode) / 8.7 / 14.5 (1.9 Volt)
1.6 (Sleep mode) / 9.6 / 16.1 (2 Volt) |
| |
| Notes on VIA C3-667MHz |
- Recommended core voltage is indicated either on the top or on the bottom of the CPU
|
