| General information |
| Type | CPU / Microprocessor |
| Family | VIA C3 Samuel2 |
| Part number | C3-700AMHz |
| Frequency (MHz) ? | 700 |
| Bus speed (MHz) ? | 100 |
| Clock multiplier ? | 7 |
| Package | 370-pin ceramic PGA
1.95" x 1.95" (4.95 cm x 4.95 cm) |
| Socket | Socket 370 |
| |
| Architecture / Microarchitecture |
| Processor core | Samuel 2 |
| Manufacturing process | 0.15 micron CMOS technology |
| Die size | 52 mm2 |
| Data width | 32 bit |
| Floating Point Unit | Integrated, running at 1/2 speed |
| Level 1 cache size ? | 64 KB 4-way associative code cache
64 KB 4-way associative data cache |
| Level 2 cache size ? | 4-way 64 KB exclusive unified (code and data) cache |
| Features | - MMX technology
- 3DNow! Technology
|
| |
| Electrical/Thermal parameters |
| V core (V) ? | 1.6 |
| Min/Max operating temperature (°C) ? | 0 - 70 |
| Min/Typical/Max power dissipation (W) | 0.98 (Sleep mode) / 5.81 / 9.88 |
| |
| Notes on VIA C3-700AMHz |
- Clock multiplier is locked
|
