VIA C3-750AMHz / Cyrix III-750AMHz

CPU Information

General information
TypeCPU / Microprocessor
FamilyVIA C3 Samuel2
CPU part numberC3-750AMHz
Frequency (MHz)  ? 750
Bus speed (MHz)  ? 100
Clock multiplier  ? 7.5
Package370-pin ceramic PGA
1.95" x 1.95" (4.95 cm x 4.95 cm)
SocketSocket 370
 
Architecture / Microarchitecture
Processor coreSamuel 2
Manufacturing process0.15 micron CMOS technology
Die size52 mm2
Data width32 bit
Floating Point UnitIntegrated, running at 1/2 speed
Level 1 cache size  ? 64 KB 4-way associative code cache
64 KB 4-way associative data cache
Level 2 cache size  ? 4-way 64 KB exclusive unified (code and data) cache
Features
  • MMX technology
  • 3DNow! Technology
 
Electrical/Thermal parameters
V core (V)  ? 1.6
Minimum/Maximum operating temperature (°C)  ? 0 - 70
Minimum/Typical/Maximum power dissipation (W)1.05 (Sleep mode) / 6.23 / 10.59
 
Notes on VIA C3-750AMHz
  • Clock multiplier is locked

Pictures (4)

Engineering sample/no heatspreader - top view

750 MHz (100 x 7.5, 1.6V)
370-pin ceramic PGA

Engineering Sample
Top view
VIA C3-750AMHz / Cyrix III-750AMHz
Engineering sample/no heatspreader - bottom view

750 MHz (100 x 7.5, 1.6V)
370-pin ceramic PGA

Engineering Sample
Bottom view
VIA C3-750AMHz / Cyrix III-750AMHz
Engineering sample/no heatspreader - top view

750 MHz (100 x 7.5, 1.7V)
370-pin ceramic PGA

Engineering Sample
Top view
VIA C3-750AMHz / Cyrix III-750AMHz
Engineering sample/no heatspreader - bottom view

750 MHz (100 x 7.5, 1.7V)
370-pin ceramic PGA

Engineering Sample
Bottom view
VIA C3-750AMHz / Cyrix III-750AMHz

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