VIA Cyrix III / VIA C3VIA Cyrix III, later renamed to C3, is a family of x86-compatible
microprocessors. The first generation of Cyrix III CPUs was based on
a Joshua core developed by Cyrix. This core was quickly replaced by
Samuel core designed by Centaur Technology. The Samuel core was
manufactured using 0.18 micro technology. The core included large
64 KB level 1 code and data caches, no level 2 cache, and had much
simpler design than the Joshua core. Next core - Samuel 2 - added
exclusive level 2 cache to VIA Cyrix III processors. Based on 0.15
micron technology, that core had more than 40% smaller die size, and
lower core voltage and power consumption than the Samuel core. With
the release of Samuel2 core the VIA Cyrix III was renamed to VIA C3.
The Samuel2 core was followed by Ezra core. Manufactured on 0.13
micron technology, the Ezra core had even lower power consumption
than the Samuel2 processors. A variation of Ezra core, called
Ezra-T, was compatible with Tualatin bus.
The last VIA C3 core was Nehemiah. This core featured full-speed integrated FPU unit, support for SSE instructions, AES encryption and random number generator. Support for 3DNow! instructions was removed from the Nehemiah processors. ![]() Picture of: VIA C3-600MHz / Cyrix III-600MHz 600 MHz (133 x 4.5, 2.0V)
370-pin ceramic PGA with heatspreader ![]() Picture of: VIA C3-750AMHz / Cyrix III-750AMHz 750 MHz (100 x 7.5, 1.6V)
370-pin ceramic PGA Engineering Sample Top view ![]() Picture of: VIA C3-933AMHz EBGA 933 MHz
133 MHz FSB 368-ball enhanced BGA ![]() Picture of: VIA C3-1.0AGHz EBGA 1 GHz
133 MHz FSB 368-ball enhanced BGA
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Search CPU-WorldIdentify partRelated LinksAt a glanceType: 32-bit microprocessor Introduction: 2000 Technology (micron): 0.13 - 0.18 Frequency (MHz): 400 - 1400 L2 cache size (KB): 0, 64 Sockets: BGA368 Socket 370 | ||||||