Intel Mobile Celeron 857 - AV8062701149001 / AV8062701022701

Intel Celeron 857 is a ultra-low voltage mobile processor for budget thin-and-light notebooks. The CPU is expected to launch in the third quarter 2011. This microprocessor is marginally faster than the Celeron 847, which was introduced in June 2011.

Intel Mobile Celeron 857 is built on Sandy Bridge microarchitecture, which integrates the following components:

• Two CPU cores, with each core having its own 64 KB level 1 and 256 KB level 2 caches.
• 2 MB level 3 cache. The L3 cache is shared between the cores and an integrated graphics controller.
• Graphics Processing Unit. The GPU can handle HD video content, but it lacks Quick Sync and Clear Video HD video processing technologies, and it doesn't support 3D Video or 3D graphics acceleration.
• DDR3 memory controller supports two channels with data rates up to 1333 MHz.
• Direct Media Interface (DMI) 2.0 is used is to communicate with South Bridge chip and all peripheral devices. The DMI 2.0 in Sandy Bridge chips delivers twice as much bandwidth as the DMI in the previous generation of Westmere microprocessors.
• PCI Express Interface.

The Intel 857 is clocked at 1.2 GHz, and, lacking Hyper-Threading technology, can execute only one thread per each core. Being a budget processor, the Celeron does not support any advanced, or even intermediate technologies, such as AES and AVX instructions, or Turbo Boost and Vpro. The CPU does include basic features, like Execute Disable bit and Intel 64, that are extensively used by modern operating systems. Low-power features on this Mobile Celeron are comprised of Enhanced SpeedStep technology, which reduces power consumption of active cores by lowering their frequency and operating voltage, and a few low-power states, used when one or two cores are idle. Thermal Design Power of this CPU is 17 Watt.

Intel Celeron 857 is manufactured in a Ball Grid Array (BGA) package, which has lower profile and smaller size than PGA packages. Main disadvantage of this package is that the BGA CPUs are usually soldered on a mainboard, and cannot be easily replaced or upgraded.