| General information |
| Type | CPU / Microprocessor |
| Family | Intel Core i3 Mobile |
| Model number ? | I3-350M |
| CPU part number | CP80617004161AC (SLBPK) |
| Frequency (MHz) ? | 2267 |
| Package | 988-pin micro-FCPGA10 (rPGA988A) |
| Socket | Socket 988 (PGA988) |
| Size | 1.48" x 1.48" / 3.75cm x 3.75cm |
| Introduction date | January 7, 2010 |
| |
| Architecture / Microarchitecture |
| Processor core | Arrandale |
| Core stepping | C2 (SLBPK) |
| Manufacturing process | 0.032 micron |
| Data width | 64 bit |
| Number of cores | 2 |
| Floating Point Unit | Integrated |
| Level 1 cache size ? | 2 x 32 KB instruction caches
2 x 32 KB data caches |
| Level 2 cache size ? | 2 x 256 KB |
| Level 3 cache size | Shared 3 MB |
| Features | - MMX instruction set
- SSE
- SSE2
- SSE3
- Supplemental SSE3
- SSE4.1 ?
- SSE4.2 ?
- EM64T technology ?
- Hyper-Threading technology
- Virtualization technology
- Execute Disable bit ?
|
| Low power features | - Thread C1, C3 and C6 states
- Core C1/C1E, C3 and C6 states
- Package C1/C1E, C3 and C6 states
- Enhanced SpeedStep technology ?
|
| On-chip peripherals | - Integrated dual-channel DDR3 SDRAM Memory controller
- Direct Media Interface
- Integrated HD graphics controller
|
| |
| Electrical/Thermal parameters |
| V core (V) ? | 0.8 - 1.4 (High Frequency mode)
0.775 - 1 (Low Frequency mode) |
| Minimum/Maximum operating temperature (°C) ? | 0 - 90 |
| Maximum power dissipation (W) ? | 64.75 (peak, CPU core only)
43.17 (sustained, CPU core only) |
| Thermal Design Power (W) ? | 35 (Package)
25 (CPU core)
12.5 (Graphics core) |
| |
| Notes on Intel CP80617004161AC |
- Graphics and memory controllers are located on a separate die, which is manufactured on 0.045 micron technology
- Integrated graphics controller runs at 500 MHz
- Memory controller supports DDR3 memory up to 1066 MHz
|
