Intel Core i3-370M Mobile processor - CP80617004119AL
Specifications
i3-370M is a dual-core microprocessor from Core i3 Mobile family of dual-core CPUs. The processor was introduced on June 20 as part of the second wave of Nehalem-based mobile microprocessors. Prior to the launch, the i3-370M model was announced in a handful of notebooks - ASUS A52 and K52-series, Dell Studio 14 and Studio 15, and Lenovo G460, IdeaPad Z360 and Z560 laptops.
The i3-370M is based on 32 nm Arrandale core, which uses two different interfaces to communicate with memory and peripheral devices, and adds HD-capable graphics controller to the package. Processor components are split between two on-package dies. Core die is manufactured on 32nm process, and incorporates two CPU cores and 3MB shared level 3 memory. The second die, built on 45nm process, contains dual-channel memory controller, and the graphics controller. Each CPU core has its own level 1 and level 2 caches, but their contents is also duplicated in L3 cache. This is done to simplify search for data, previously cached by all cores.
The Core i3-370M is clocked at 2.4 GHz. Being a mid-class CPU, the 370M incorporates only selected features of the Arrandale core. 64-bit mode, Execute disable bit, SSE - SSE4 instructions, and Virtualization are essential technologies that are included in all Core ix models, and on this one too. In addition to essential features, this Core i3-370M has HyperThreading technology. This technology doubles the number of simultaneously processed threads and improves performance by small margin. Power-saving features on this microprocessor are low-power states and Enhanced SpeedStep technology. Under full load, the processor and graphics controller use less than 35 Watt of power. The CPU is produced in 988-pin micro-PGA package compatible with socket 988 motherboards.
The i3-370M is based on 32 nm Arrandale core, which uses two different interfaces to communicate with memory and peripheral devices, and adds HD-capable graphics controller to the package. Processor components are split between two on-package dies. Core die is manufactured on 32nm process, and incorporates two CPU cores and 3MB shared level 3 memory. The second die, built on 45nm process, contains dual-channel memory controller, and the graphics controller. Each CPU core has its own level 1 and level 2 caches, but their contents is also duplicated in L3 cache. This is done to simplify search for data, previously cached by all cores.
The Core i3-370M is clocked at 2.4 GHz. Being a mid-class CPU, the 370M incorporates only selected features of the Arrandale core. 64-bit mode, Execute disable bit, SSE - SSE4 instructions, and Virtualization are essential technologies that are included in all Core ix models, and on this one too. In addition to essential features, this Core i3-370M has HyperThreading technology. This technology doubles the number of simultaneously processed threads and improves performance by small margin. Power-saving features on this microprocessor are low-power states and Enhanced SpeedStep technology. Under full load, the processor and graphics controller use less than 35 Watt of power. The CPU is produced in 988-pin micro-PGA package compatible with socket 988 motherboards.
Tools
Intel Core i3-370M specifications
| General information | ||||||||||
| Type | CPU / Microprocessor | |||||||||
| Market segment | Mobile | |||||||||
| Family | Intel Core i3 Mobile | |||||||||
| Model number ? | i3-370M | |||||||||
| CPU part number | CP80617004119AL is an OEM/tray microprocessor | |||||||||
| Frequency ? | 2400 MHz | |||||||||
| Low power frequency | 933 MHz | |||||||||
| Clock multiplier ? | 18 | |||||||||
| Package | 988-pin micro-FCPGA10 (rPGA988A) | |||||||||
| Socket | Socket G1 / rPGA988A | |||||||||
| Size | 1.48" x 1.48" / 3.75cm x 3.75cm | |||||||||
| Weight | 0.3oz / 7.7g | |||||||||
| Introduction date | June 20, 2010 | |||||||||
| End-of-Life date | Last order date is October 16, 2012 Last shipment date is April 16, 2013 | |||||||||
| S-spec numbers | ||||||||||
| ||||||||||
| Architecture / Microarchitecture | ||||||||||
| Microarchitecture | Nehalem (Westmere) | |||||||||
| Platform | Calpella | |||||||||
| Processor core ? | Arrandale | |||||||||
| Core stepping ? | K0 (Q4CH, SLBUK) | |||||||||
| CPUID | 20655 (Q4CH, SLBUK) | |||||||||
| Manufacturing process | 0.032 micron 382 million transistors (CPU die) 177 million transistors (IMC / graphics die) | |||||||||
| Die size | 81mm2 (CPU die) 114mm2 (IMC / graphics die) | |||||||||
| Data width | 64 bit | |||||||||
| The number of cores | 2 | |||||||||
| The number of threads | 4 | |||||||||
| Floating Point Unit | Integrated | |||||||||
| Level 1 cache size ? | 2 x 32 KB instruction caches 2 x 32 KB data caches | |||||||||
| Level 2 cache size ? | 2 x 256 KB | |||||||||
| Level 3 cache size | Shared 3 MB | |||||||||
| Cache latency | 4 (L1 cache) 11 (L2 cache) 38 (L3 cache) | |||||||||
| Multiprocessing | Not supported | |||||||||
| Features |
| |||||||||
| Low power features | Enhanced SpeedStep technology ? | |||||||||
| Integrated peripherals / components | ||||||||||
| Integrated graphics |
| |||||||||
| Memory controller |
| |||||||||
| Other peripherals | Direct Media Interface | |||||||||
| Electrical / Thermal parameters | ||||||||||
| Minimum/Maximum operating temperature ? | 0°C - 90°C | |||||||||
| Thermal Design Power ? | 35 Watt | |||||||||
| Notes on Intel CP80617004119AL | ||||||||||
| ||||||||||
CPUs, related to Intel Core i3-370M (PGA988)
| Model | Cores / Threads |
Freq. | Turbo freq. |
L3 cache |
TDP | Features |
|---|---|---|---|---|---|---|
| Intel Core i3 Mobile family, Socket G1 | ||||||
| Core i3-330M (PGA988) | 2 / 4 | 2.13 GHz | 3 MB | 35 Watt | SSE4, HT, VT | |
| Core i3-350M (PGA988) | 2 / 4 | 2.26 GHz | 3 MB | 35 Watt | SSE4, HT, VT | |
| Core i3-370M (PGA988) | 2 / 4 | 2.4 GHz | 3 MB | 35 Watt | SSE4, HT, VT | |
| Core i3-380M (PGA988) | 2 / 4 | 2.53 GHz | 3 MB | 35 Watt | SSE4, HT, VT | |
| Core i3-390M (PGA988) | 2 / 4 | 2.66 GHz | 3 MB | 35 Watt | SSE4, HT, VT | |
| Intel Core i3 Mobile family, Nehalem micro-architecture, Other sockets | ||||||
| Core i3-330UM | 2 / 4 | 1.2 GHz | 3 MB | 18 Watt | SSE4, HT, VT | |
| Core i3-380UM | 2 / 4 | 1.33 GHz | 3 MB | 18 Watt | SSE4, HT, VT | |
| Core i3-330M (BGA) | 2 / 4 | 2.13 GHz | 3 MB | 35 Watt | SSE4, HT, VT | |
| Core i3-350M (BGA) | 2 / 4 | 2.26 GHz | 3 MB | 35 Watt | SSE4, HT, VT | |
| Core i3-370M (BGA) | 2 / 4 | 2.4 GHz | 3 MB | 35 Watt | SSE4, HT, VT | |
| Core i3-380M (BGA) | 2 / 4 | 2.53 GHz | 3 MB | 35 Watt | SSE4, HT, VT | |
| Core i3-390M (BGA) | 2 / 4 | 2.66 GHz | 3 MB | 35 Watt | SSE4, HT, VT | |
| Other families, Nehalem micro-architecture, Socket G1 | ||||||
| Celeron P4500 | 2 / 2 | 1.86 GHz | 2 MB | 35 Watt | SSE4, HT, VT | |
| Celeron P4600 | 2 / 2 | 2 GHz | 2 MB | 35 Watt | SSE4, HT, VT | |
| Pentium P6200 | 2 / 2 | 2.13 GHz | 3 MB | 35 Watt | SSE4, HT, VT | |
| Pentium P6300 | 2 / 2 | 2.26 GHz | 3 MB | 35 Watt | SSE4, HT, VT | |
| Core i5-560M (PGA988) | 2 / 4 | 2.66 GHz | 3.2 GHz | 3 MB | 35 Watt | SSE4, AES, HT, VT, TXT, TBT |
| Core i5-580M (PGA988) | 2 / 4 | 2.66 GHz | 3.33 GHz | 3 MB | 35 Watt | SSE4, AES, HT, VT, TXT, TBT |
| Core i7-820QM | 4 / 8 | 1.73 GHz | 3.06 GHz | 8 MB | 45 Watt | SSE4, HT, VT, TXT, TBT |
| Core i7-840QM | 4 / 8 | 1.86 GHz | 3.2 GHz | 8 MB | 45 Watt | SSE4, HT, VT, TXT, TBT |
| Core i7-920XM | 4 / 8 | 2 GHz | 3.2 GHz | 8 MB | 55 Watt | SSE4, HT, VT, TXT, TBT, Unlock |
| Core i7-940XM | 4 / 8 | 2.13 GHz | 3.33 GHz | 8 MB | 55 Watt | SSE4, HT, VT, TXT, TBT, Unlock |
• Highlighted numbers and features indicate whether specific processor performs better or worse than Core i3-370M (PGA988)
• Within each category, the CPUs are sorted from slower (at the top) to faster (at the bottom)
• List of related CPUs is not complete.
• Features abbreviations:
SSE4 - SSE4 instructions
AES - AES instructions
HT - Hyper-Threading
VT - Virtualization
TXT - Trusted Execution
TBT - Dynamic Acceleration / Turbo Boost
Unlock - Unlocked multiplier
AES - AES instructions
HT - Hyper-Threading
VT - Virtualization
TXT - Trusted Execution
TBT - Dynamic Acceleration / Turbo Boost
Unlock - Unlocked multiplier
FAQ
Q: I have an Intel i3-370M CPU. Is it possible to upgrade it?
A: Probably yes. CPU compatibility is determined by your motherboard. Please see CPU-Upgrade.com website for CPU support list for your board.
Intel i3-370M Overclocking
Sorry, overclocking information is not available at this time.
Pictures (2)
| Core i3-370M CPU pictures | |
Top view. S-Spec numbers is SLBUK. The processor was manufactured at the end of July 2010. |
 |
Bottom view. |
 |
News
Intel discontinues mobile processors
Apr 19, 2012: This week Intel published three Product change Notifications,
advising its customer of forthcoming discontinuation of several mobile
processors. All retired processors are from Westemere group of
families, built on 32nm technology. 6 OEM microprocessors, including
P4600, P6100, P6200, P6300, Core i3-370M and i3-390M will be
end-of-lifed on October 16, 2012, and their last shipment date is
April 16, 2013. In addition to OEM chips, Intel is planning to retire
boxed Core i5-520M, i5-540M, i5-560M and i5-580M CPUs. Their last
order (EOL) date is October 19, 2012, and they will be shipped until
January 18.
New Mobile CPUs introduced, part II
Jun 22, 2010: Mobile Core i7 microprocessors were not the only processors released
yesterday. Today Intel posted specifications for three other models, that
didn't make into the price list. These are Core i5-450M, Core i3-370M
and Pentium P6000 CPUs, all based on 32nm Arrandale core.
More notebooks with upcoming Intel Core i3 / i5 / i7 processors
May 26, 2010: On May 21 we posted specifications of new mobile microprocessors,
as well as names of a few notebooks where these processors will be
shipped. As more and more information about new notebooks with
upcoming CPUs appears on the net, we decided to provide additional
information in this news story.
Specifications of upcoming Intel Mobile microprocessors
May 21, 2010: Using different sources, we compiled specifications of upcoming
Intel mobile CPUs. These processors are Core i3-370M, Core i5-450M,
Core i7-740QM, Core i7-840QM and Core Extreme Edition i7-940XM. We
also discovered two Pentium Mobile models - P6000 and P6100.
Benchmarks
Benchmark tools
- For additional benchmarks, comparing multi-threaded performance of this microprocessor with other Core i3 Mobile CPUs and the fastest AMD and Intel x86 chips, please visit Intel Core i3-370M (PGA988) benchmarks page.
Intel i3-370M (PGA988) benchmarks
The graphs below show up to 10 processors with aproximately the same level of performance in different types of applications. All processors were tested at nominal frequency (not overclocked), with stock heatsink and default BIOS settings. To see how the i3-370M (PGA988) compares to other CPUs please see benchmark tools section above.
Benchmarked processor
| S-spec number: | SLBUK |
| CPU ID: | 20655 |
| CPU vendor string: | GenuineIntel |
| CPU name string: | Intel(R) Core(TM) i3 CPU M 370 @ 2.40GHz |
Integer performance
| Part number | Result | |
|---|---|---|
| 105.8% | ||
| 105.1% | ||
| 102.9% | ||
| 100.5% | ||
| 100.3% | ||
| 100% | ||
| 99.9% | ||
| 99.8% | ||
| 98.4% | ||
| 96.2% | ||
| 94.9% |
Floating Point performance
| Part number | Result | |
|---|---|---|
| 112.3% | ||
| 111.3% | ||
| 105.7% | ||
| 105.5% | ||
| 102.8% | ||
| 100% | ||
| 97.3% | ||
| 95.7% | ||
| 94.9% | ||
| 91.9% | ||
| 91.9% |
MMX / SSE / SSE2 performance
| Part number | Result | |
|---|---|---|
| 111.1% | ||
| 108.7% | ||
| 105.5% | ||
| 102.7% | ||
| 101.4% | ||
| 100% | ||
| 98.9% | ||
| 97.6% | ||
| 97.1% | ||
| 92.6% | ||
| 92.1% |
Memory-intensive program performance
| Part number | Result | |
|---|---|---|
| 103.3% | ||
| 103.3% | ||
| 101.8% | ||
| 101.4% | ||
| 100.3% | ||
| 100% | ||
| 99.6% | ||
| 97.6% | ||
| 97.3% | ||
| 95.7% | ||
| 95.3% |
CPU ID (1)
CPUID Tools
- Search or browse all public submissions in our CPUID database.
- Use our CPU identification tool to check features of your CPU.
CPUID features of Intel i3-370M
NOTE: The CPU ID information below was taken from one CPU and may include features that are not present in all different steppings of the Intel Core i3 Mobile i3-370M CPU.
|
|
| General information | |
|---|---|
| Vendor: | GenuineIntel |
| Processor name (BIOS): | Intel(R) Core(TM) i3 CPU M 370 @ 2.40GHz |
| Cores: | 2 |
| Logical processors: | 4 |
| Processor type: | Original OEM Processor |
| CPUID signature: | 20655 |
| Family: | 6 (06h) |
| Model: | 37 (025h) |
| Stepping: | 5 (05h) |
| TLB/Cache details: | 64-byte Prefetching Data TLB0: 2-MB or 4-MB pages, 4-way associative, 32 entries Data TLB: 4-KB Pages, 4-way set associative, 64 entries Instruction TLB: 2-MB or 4-MB pages, fully associative, 7 entries Instruction TLB: 4-KB pages, 4-way set associative, 64 entries Shared 2nd-level TLB: 4 KB pages, 4-way set associative, 512 entries |
| Cache: | L1 data | L1 instruction | L2 | L3 |
|---|---|---|---|---|
| Size: | 2 x 32 KB | 2 x 32 KB | 2 x 256 KB | 3 MB |
| Associativity: | 8-way set associative |
4-way set associative |
8-way set associative |
12-way set associative |
| Line size: | 64 bytes | 64 bytes | 64 bytes | 64 bytes |
| Comments: | Direct-mapped | Direct-mapped | Non-inclusive Direct-mapped |
Inclusive Direct-mapped Shared between all cores |
| Instruction set extensions | Additional instructions | ||
|---|---|---|---|
| MMX | CLFLUSH | ||
| SSE | CMOV | ||
| SSE2 | CMPXCHG16B | ||
| SSE3 | CMPXCHG8B | ||
| SSSE3 | FXSAVE/FXRSTORE | ||
| SSE4.1 | MONITOR/MWAIT | ||
| SSE4.2 | POPCNT | ||
| RDTSCP | |||
| SYSENTER/SYSEXIT | |||
| Major features | Other features | ||
| On-chip Floating Point Unit | 36-bit page-size extensions | ||
| 64-bit / Intel 64 | 64-bit debug store | ||
| NX bit/XD-bit | Advanced programmable interrupt controller | ||
| Hyper-Threading Technology | CPL qualified debug store | ||
| Intel Virtualization | Debug store | ||
| Enhanced SpeedStep | Debugging extensions | ||
| Digital Thermal Sensor capability | |||
| LAHF / SAHF support in 64-bit mode | |||
| Machine check architecture | |||
| Machine check exception | |||
| Memory-type range registers | |||
| Model-specific registers | |||
| Page attribute table | |||
| Page global extension | |||
| Page-size extensions (4MB pages) | |||
| Pending break enable | |||
| Perfmon and Debug capability | |||
| Physical address extensions | |||
| Process context identifiers | |||
| Self-snoop | |||
| TSC rate is ensured to be invariant across all states | |||
| Thermal monitor | |||
| Thermal monitor 2 | |||
| Thermal monitor and software controlled clock facilities | |||
| Time stamp counter | |||
| Virtual 8086-mode enhancements | |||
| xTPR Update Control | |||
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