- CPU die, built on 32nm process, that contains shared 4MB L3 cache and two microprocessors cores, each with 64 KB L1 cache and 256 KB L2 cache.
- Separate die with DDR3 memory controller and graphics controller. This die is manufactured on 45nm process.
- HyperThreading technology improves processor performance when the CPU execute more than two threads simultaneously.
- Virtualization technology provides improved hardware support when there is a need to run guest programs or operating systems in a virtual environment.
- Support for SIMD instructions up to SSE4.
The Intel Core i3-550 doesn't include Turbo Boost and AES instructions. The processor is manufactured in 1156-land package, compatible with socket 1156 motherboards.
With 3.2 GHz core frequency, the Core i3-550 has a lot in common with more expensive Core i5-650 model. In comparison with the 650 CPU, the most important missing consumer feature on the i3-550 is Turbo Boost technology. The Core i5-650 also incorporates Vpro features and SSE instructions, which are not supported by the i3-550 model. Despite of missing features, the Core i3-550 performs quite well in comparison with the i5-650. In our benchmarks the 550 was up to 9% slower in single-threaded applications, and from 0% to 5% slower in multi-threaded benchmarks. Currently, in June 2010, the i3-550 is officially priced at $138, or about 27% lower than the price of the 650 CPU. This makes the i3-550 much more cost effective than feature-rich i5-650 model. What's interesting is that at this moment i3-550 costs only $5 more than the Core i3-540, while offering up to 5% better performance in some applications. If the retail prices on these CPUs will exhibit the same difference, then we can recommend the 550 model over the 540 in most cases due to it's better price / performance ratio.
Intel Core i3-550 specifications
|Type||CPU / Microprocessor|
|Family||Intel Core i3|
|CPU part numbers||CM80616003174AJ is an OEM/tray microprocessor|
BX80616I3550 is a boxed processor (English version)
BXC80616I3550 is a boxed processor (Chinese version)
|Package||1156-land Flip-Chip Land Grid Array (FC-LGA10)|
|Socket||Socket 1156 / H1 / LGA1156|
|Size||1.48" x 1.48" / 3.75cm x 3.75cm|
|Weight||0.9oz / 24.2g|
|Introduction date||May 30, 2010|
|End-of-Life date||Last order date for consumer processors is June 29, 2012|
Last shipment date for consumer tray processors is December 7, 2012
|Price at introduction||$138|
|Architecture / Microarchitecture|
|Core stepping||K0 (SLBUD)|
|Manufacturing process||0.032 micron|
382 million transistors (CPU die)
177 million transistors (IMC / graphics die)
|Die size||81mm2 (CPU die)|
114mm2 (IMC / graphics die)
|Data width||64 bit|
|The number of cores||2|
|The number of threads||4|
|Floating Point Unit||Integrated|
|Level 1 cache size||2 x 32 KB instruction caches|
2 x 32 KB data caches
|Level 2 cache size||2 x 256 KB|
|Level 3 cache size||4 MB shared cache|
|Physical memory||16 GB|
|Low power features|
|Integrated peripherals / components|
|Other peripherals||Direct Media Interface|
|Electrical / Thermal parameters|
|V core||0.65V - 1.4V|
|Minimum/Maximum operating temperature||5°C - 72.6°C|
|Thermal Design Power||73 Watt|
|Notes on Intel CM80616003174AJ|