| General information |
| Type | CPU / Microprocessor |
| Family | Intel Core i7 |
| Model number ? | I7-960 |
| CPU part number | AT80601002727AA (SLBEU) |
| Frequency (MHz) ? | 3200 |
| Bus speed (MHz) ? | 2400 MHz QPI |
| Package | 1366-land Flip-Chip Land Grid Array (FC-LGA8) |
| Socket | Socket 1366 (LGA1366) |
| Introduction date | Oct 18, 2009 |
| Price at introduction | $562 |
| |
| Architecture / Microarchitecture |
| Processor core | Bloomfield |
| Core stepping | D0 (SLBEU) |
| Manufacturing process | 0.045 micron Hi-k metal gate technology
731 million transistors |
| Die size | 263 mm2 |
| Data width | 64 bit |
| Number of cores | 4 |
| Floating Point Unit | Integrated |
| Level 1 cache size ? | 4 x 32 KB instruction caches
4 x 32 KB data caches |
| Level 2 cache size ? | 4 x 256 KB |
| Level 3 cache size | Inclusive shared 8 MB cache |
| Features | - MMX instruction set
- SSE
- SSE2
- SSE3
- Supplemental SSE3
- SSE4.1 ?
- SSE4.2 ?
- EM64T technology ?
- Hyper-Threading technology
- Turbo Boost technology ?
- Virtualization technology
- Execute Disable bit ?
|
| Low power features | - Thread C1, C3 and C6 states
- Core C1, C3 and C6 states
- Package C3 and C6 states
- Enhanced SpeedStep technology ?
|
| On-chip peripherals | - Integrated triple-channel DDR3 SDRAM Memory controller
- Quick Path Interconnect
|
| |
| Electrical/Thermal parameters |
| V core (V) ? | 0.8 - 1.375 |
| Thermal Design Power (W) ? | 130 |
