Intel Core i7-2677M Mobile processor (AV8062701041005)

Intel Core i7-2677M is an ultra-low voltage (ULV) processor for high-performance ultra-thin and light laptops. Launched in June 2011, this 1.8 Ghz model had the best performance from all Intel ULV microprocessors, built on Sandy Bridge and earlier microarchitectures. The CPU is based on 32nm Sandy Bridge core, which combines two CPU cores, shared large L3 cache, graphics processing unit (GPU), memory controller, and PCI Express and Direct Media interfaces. Each CPU core on the Intel i7-2677M includes dedicated 64 KB (32KB + 32KB) first level and 256 KB unified second level caches. A 4MB third level cache is shared between the CPU cores and the integrated GPU. The graphics unit on the microprocessor belongs to HD 3000 class, and it can handle video 3D and/or HD content, as well as 3D graphics acceleration. Integrated memory controller, used to access system RAM, has two DDR3 memory channels, and supports up to 1333 MHz data rates.

The Core i7-2677M supports all performance enhancing and low-power features, that come with the Sandy Bridge microarchitecture. Incorporated Hyper-Threading technology allows each CPU core to execute two threads at once. Turbo Boost feature is used to bump processor frequency up to 2.9 GHz when only one core is operational. The i7-2677M also has Vpro technologies, comprised of VT-d virtualization and Trusted Execution. The CPU supports all instructions extensions up to AES acceleration instructions, and 256-bit Advanced Vector Extensions. Low-power features on this model include low-power states, and enhanced SpeedStep technology. Low-power states, used when one or both cores are idle, can significantly reduce power consumption by turning off power to some or all components of CPU cores. SpeedStep technology, used to reduce battery power in active mode, does it by lowering CPU clock frequency and core voltage.

The Core i7-2677M is manufactured in a micro-BGA package, which has lower profile and smaller size than micro-PGA packages. The main disadvantage of the micro-BGA package is that it can't be replaced or upgraded.