| General information |
| Type | CPU / Microprocessor |
| Frequency (MHz) ? | 300 |
| Bus speed (MHz) ? | 66 |
| Clock multiplier ? | 4.5 |
| Package | 368-ball enhanced BGA
1.38" x 1.38" (3.5 cm x 3.5 cm) |
| |
| Architecture / Microarchitecture |
| Processor core | Samuel 2 |
| Manufacturing process | 0.15 micron CMOS technology |
| Die size | 52 mm2 |
| Floating Point Unit | Integrated |
| Level 1 cache size ? | 64 KB 4-way set-associative instruction cache
64 KB 4-way set-associative data cache |
| Level 2 cache size ? | Unified exclusive 64 KB 4-way set-associative |
| Multiprocessing | Not supported |
| Features | - MMX technology
- 3DNow! technology
|
| Low power features | - Quickstart state
- Sleep state ?
- Deep Sleep state ?
- Deeper Sleep state
|
| |
| Electrical/Thermal parameters |
| V core (V) ? | 1.05 |
| Min/Max operating temperature (°C) ? | 0 - 85 |
| Min/Typical/Max power dissipation (W) | 0.9 (Sleep mode) / 1.4 / 2.5 |
| |
| Notes |
- Processors, marked with 'S' on the top, do not have clock multiplier locked
- Floating-Point Unit runs at 1/2 of CPU speed
- Maximum case temperature is 100 degrees Celsius for parts marked 100°
|
