| Microprocessor information |
|---|
| Type | Microprocessor |
| Processor core | Samuel 2 |
| Manufacturing process | 0.15 micron CMOS technology |
| Package | 368-ball enhanced BGA
1.38" x 1.38" (3.5 cm x 3.5 cm) |
| Speed (MHz) | 600 |
| Bus frequency (MHz) | 133 |
| Clock multiplier | 4.5 |
| Multiprocessing | Not supported |
| Low power features |
- Quickstart state
- Sleep state
- Deep Sleep state
- Deeper Sleep state
|
| Other features |
- MMX technology
- 3DNow! technology
|
| Level 1 cache size | 64 KB 4-way set-associative instruction cache
64 KB 4-way set-associative data cache |
| Level 2 cache size | Unified exclusive 64 KB 4-way set-associative |
| Floating Point Unit | Integrated |
| V core (V) | 1.2 |
| Min/Max operating temperature (°C) | 0 - 85 |
| Min/Typical/Max power dissipation (W) | 1.3 (Sleep mode) / 3.2 / 6 |
Notes:- Processors, marked with 'S' on the top, do not have clock multiplier locked
- Floating-Point Unit runs at 1/2 of CPU speed
- Maximum case temperature is 100 degrees Celsius for parts marked 100°
|
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