| Type | Microprocessor |
| Manufacturing process | 0.18-micron four layer metal CMOS |
| Package | 352-ball BGA
1.34" x 1.34" (3.4 cm x 3.4 cm) |
| Speed (MHz) | 266 |
| Bus frequency (MHz) | 33 |
| Clock multiplier | 8 |
| On-chip peripherals |
- PCI controller
- Display controller and 2D Graphics accelerator
- 16-bit audio subsystem
- SDRAM controller with 64-bit wide memory bus
|
| Low power features |
- System management mode
- Suspend-on-Halt mode
- CPU Suspend mode
- 3V suspend mode
- Suspend modulation mode
- APM and ACPI support
|
| Other features |
- MMX instruction set
- Extended MMX instructions
|
| Level 1 cache size | 16 KB 4-way set associative write-back unified instruction and data cache |
| Floating Point Unit | Integrated |
| V core (V) | 1.8 ± 5% |
| V I/O or secondary (V) | 3.3 ± 5% |
| Max operating temperature (°C) | 85 |
| Typical/Max power dissipation (W) | 1.9 / 2.92 |
|
|
GX1 family