| General information |
| Type | CPU / Microprocessor |
| Frequency (MHz) ? | 266 |
| Bus speed (MHz) ? | 33 |
| Clock multiplier ? | 8 |
| Package | 320-pin Ceramic PGA
1.952" x 1.952" (4.96 cm x 4.96 cm) |
| |
| Architecture / Microarchitecture |
| Manufacturing process | 0.18-micron four layer metal CMOS |
| Floating Point Unit | Integrated |
| Level 1 cache size ? | 16 KB 4-way set associative write-back unified instruction and data cache |
| Features | - MMX instruction set
- Extended MMX instructions
|
| Low power features | - System management mode
- Suspend-on-Halt mode
- CPU Suspend mode
- 3V suspend mode
- Suspend modulation mode
- APM and ACPI support
|
| On-chip peripherals | - PCI controller
- Display controller and 2D Graphics accelerator
- 16-bit audio subsystem
- SDRAM controller with 64-bit wide memory bus
|
| |
| Electrical/Thermal parameters |
| V core (V) ? | 1.8 ± 5% |
| V I/O or secondary (V) | 3.3 ± 5% |
| Maximum operating temperature (°C) ? | 85 |
| Typical/Maximum power dissipation (W) | 1.9 / 2.92 |