| General information |
| Type | CPU / Microprocessor |
| Frequency (MHz) ? | 300 |
| Bus speed (MHz) ? | 33 |
| Clock multiplier ? | 9 |
| Package | 352-ball BGA
1.34" x 1.34" (3.4 cm x 3.4 cm) |
| |
| Architecture / Microarchitecture |
| Manufacturing process | 0.18-micron four layer metal CMOS |
| Floating Point Unit | Integrated |
| Level 1 cache size ? | 16 KB 4-way set associative write-back unified instruction and data cache |
| Features | - MMX instruction set
- Extended MMX instructions
|
| Low power features | - System management mode
- Suspend-on-Halt mode
- CPU Suspend mode
- 3V suspend mode
- Suspend modulation mode
- APM and ACPI support
|
| On-chip peripherals | - PCI controller
- Display controller and 2D Graphics accelerator
- 16-bit audio subsystem
- SDRAM controller with 64-bit wide memory bus
|
| |
| Electrical/Thermal parameters |
| V core (V) ? | 2 ± 5% |
| V I/O or secondary (V) | 3.3 ± 5% |
| Maximum operating temperature (°C) ? | 85 |
| Typical/Maximum power dissipation (W) | 2.42 / 3.68 |
