| General information |
| Type | CPU / Microprocessor |
| Family | AMD Geode_GX2 |
| Part number | AGXD500EEXE0BC |
| Frequency (MHz) | 366 |
| Bus speed (MHz) ? | - 66 (PCI interface)
- 122 (Memory controller)
|
| Package | 396-ball Ball Grid Array Cavity UP (TEPBGA)
1.38" x 1.38" (3.5 cm x 3.5 cm) |
| |
| Architecture / Microarchitecture |
| Manufacturing process | 0.15 micron |
| Data width | 32 bit |
| Floating Point Unit | Integrated |
| Level 1 cache size ? | 16 KB instruction cache
16 KB data cache |
| Level 2 cache size ? | None |
| Features | - MMX technology
- 3DNow!
- Geode Castle instructions
|
| Low power features | - Active Idle mode
- Sleep mode ?
|
| On-chip peripherals | - GeodeLink Control processor, Interface Units, 64-bit DDR SDRAM memory controller and PCI Bridge
- Display controller
- 2D graphics processor
- I/O Companion device interface
- TFT controller
|
| |
| Electrical/Thermal parameters |
| Min/Recommended/Max V core (V) | 1.42 / 1.5 / 1.58 |
| Min/Recommended/Max V I/O (V) | 3.14 / 3.3 / 3.46 |
| Min/Recommended/Max V memory (V) | 2.38 / 2.5 / 2.62 |
| Min/Max operating temperature (°C) ? | 0 - 85 |
| Min/Typical/Max power dissipation (W) | 2.15 (Active Idle mode) / 3.18 / 5.16 (CRT display)
2.06 (Active Idle mode) / 3.2 / 5.61 (TFT display) |
| Thermal Design Power (W) ? | 3.5 |
| |
| Notes on AMD AGXD500EEXE0BC |
- The processor supports CRT and TFT displays
|
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