AMD Geode GX 500 AGXD500EEXE0BD
Specifications
| General information | |
| Type | CPU / Microprocessor |
| Market segment | Embedded |
| Family | AMD Geode GX2 |
| CPU part number | AGXD500EEXE0BD is an OEM/tray microprocessor |
| Frequency (MHz) ? | 366 |
| Bus speed (MHz) ? |
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| Package | 396-ball lead-free Ball Grid Array Cavity UP (TEPBGA) 1.38" x 1.38" (3.5 cm x 3.5 cm) |
| Socket | BGA396 |
| Introduction date | May 24, 2004 |
| Price at introduction | $29.1 |
| Architecture / Microarchitecture | |
| Manufacturing process | 0.15 micron |
| Data width | 32 bit |
| Floating Point Unit | Integrated |
| Level 1 cache size ? | 16 KB instruction cache 16 KB data cache |
| Level 2 cache size ? | None |
| Pipeline | 8 stages |
| Features |
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| Low power features |
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| On-chip peripherals |
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| Electrical/Thermal parameters | |
| Min/Recommended/Max V core (V) | 1.42 / 1.5 / 1.58 |
| Min/Recommended/Max V I/O (V) | 3.14 / 3.3 / 3.46 |
| Min/Recommended/Max V memory (V) | 2.38 / 2.5 / 2.62 |
| Minimum/Maximum operating temperature (°C) ? | 0 - 85 |
| Minimum/Typical/Maximum power dissipation (W) | 2.15 (Active Idle mode) / 3.18 / 5.16 (CRT display) 2.06 (Active Idle mode) / 3.2 / 5.61 (TFT display) |
| Thermal Design Power (W) ? | 3.5 |
| Notes on AMD AGXD500EEXE0BD | |
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