| General information |
| Type | System-on-a-Chip |
| Family | AMD Geode_SC1200 |
| Part number | SC1200UFH-266 |
| Frequency (MHz) ? | 266 |
| Bus speed (MHz) ? | - 33 MHz (PCI interface)
- 66 MHz - 100 MHz (Memory controller)
|
| Package | 481-ball Thermally Enhanced Plastic Ball Grid Array (TEPBGA)
1.57" x 1.57" (4 cm x 4 cm) |
| |
| Architecture / Microarchitecture |
| Data width | 32 bit |
| Floating Point Unit | Integrated |
| Level 1 cache size ? | 16 KB unified cache |
| Features | MMX technology |
| Low power features | - Active Idle state
- Sleep states SL1, SL2, SL3, SL4 and SL5
|
| On-chip peripherals | - 64-bit SDRAM memory controller
- PCI bus controller
- Display controller
- 2D graphics accelerator
- Video Processor Module with CRT , TFT and TV interfaces, and Video Input Port
- Core Logic module with USB, IDE, PCI bus and LPC bus interfaces
- Super I/O module with serial, parallel and ACCESS.bus interfaces
|
| |
| Electrical/Thermal parameters |
| Min/Recommended/Max V core (V) | 1.71 / 1.8 / 2.1 |
| V I/O or secondary (V) | 3.3 ± 5% |
| Min/Max operating temperature (°C) ? | 0 - 85 |
| Min/Typical/Max power dissipation (W) | 0.15 (Sleep SL2 mode) / 2.51 / 3.36 (TFT interface)
0.15 (Sleep SL2 mode) / 2.81 / 3.71 (TV interface)
0.15 (Sleep SL2 mode) / 2.61 / 3.47 (CRT interface) |
