| General information |
| Type | System-on-a-Chip |
| Family | AMD Geode_SC2200 |
| Part number | SC2200UFH-266F |
| Frequency (MHz) ? | 266 |
| Bus speed (MHz) ? | - 33 MHz PCI interface
- 66 - 100 MHz memory controller
|
| Package | 481-ball lead free Thermally Enhanced Plastic Ball Grid Array (TEPBGA)
1.57" x 1.57" (4 cm x 4 cm) |
| |
| Architecture / Microarchitecture |
| Data width | 32 bit |
| Floating Point Unit | Integrated |
| Level 1 cache size ? | 16 KB unified cache |
| Features | MMX technology |
| Low power features | - Active Idle state
- Sleep states SL1, SL2, SL3, SL4 and SL5
|
| On-chip peripherals | - 64-bit SDRAM memory controller
- PCI bus controller
- 2D graphics controller
- Display controller
- Video Input Port
- CRT and TFT interfaces
- Core Logic module with USB, IDE, PCI bus, LPC bus interfaces and Audio codec
- Super I/O module with serial, parallel and ACCESS.bus interfaces
|
| |
| Electrical/Thermal parameters |
| V core (V) ? | 1.8 ± 5% |
| Min/Max operating temperature (°C) ? | 0 - 85 |
| Min/Typical/Max power dissipation (W) | 0.15 (Sleep mode) / 2.51 / 3.13 (TFT interface)
0.15 (Sleep mode) / 2.61 / 3.24 (CRT interface) |
