| General information |
| Family | AMD Phenom II X3 |
| Model number ? | B75 |
| CPU part number | HDXB75WFK3DGI |
| Frequency (MHz) ? | 3000 |
| Bus speed (MHz) ? | - 667 MHz Memory controller
- One 1800 MHz 16-bit HyperTransport link
|
| Package | 938-pin organic micro-PGA |
| Sockets | Socket AM2+
Socket AM3 |
| |
| Architecture / Microarchitecture |
| Processor core | Heka |
| Core stepping | C2 |
| Manufacturing process | 0.045 micron SOI |
| Die size | 243 mm2 |
| Data width | 64 bit |
| Number of cores | 3 |
| Floating Point Unit | Integrated |
| Level 1 cache size ? | 3 x 64 KB 2-way associative instruction caches
3 x 64 KB 2-way associative data caches |
| Level 2 cache size ? | 3 x 512 KB 16-way associative caches |
| Level 3 cache size | 6 MB shared 48-way associative cache |
| Features | - MMX
- 3DNow!
- SSE
- SSE2
- SSE3
- SSE4a ?
- Advanced Bit Manipulation ?
- AMD64 technology ?
- AMD-V (virtualization) technology
- Enhanced Virus Protection ?
|
| Low power features | - Cool'n'Quiet 3.0
- CoolCore Technology ?
- Dual Dynamic Power Management ?
- Core C1 and C1E states
- Package S0, S1, S3, S4 and S5 states
|
| On-chip peripherals | - Integrated 144-bit DDR2 Memory Controller
- HyperTransport 3 technology
|
| |
| Electrical/Thermal parameters |
| V core (V) ? | 0.8 - 1.425 |
| Maximum operating temperature (°C) ? | 73 |
| Thermal Design Power (W) ? | 95 |
