| General information |
| Type | CPU / Microprocessor |
| Family | AMD Third Generation Opteron |
| Model number ? | 2346 HE |
| CPU part number | OS2346PAL4BGH |
| Box part number | OS2346PAL4BGHWOF |
| Stepping code | GAAFB AA |
| Frequency (MHz) ? | 1800 |
| Bus speed (MHz) ? | - 1600 MHz (integrated memory controller)
- 1000 MHz (HyperTransport links)
|
| Package | 1207-land lidded LGA |
| Socket | Socket Fr2(1207) |
| Introduction date | April 9, 2008 |
| Price at introduction | $255 |
| |
| Architecture / Microarchitecture |
| Processor core | Barcelona |
| Core stepping | B3 |
| Manufacturing process | 0.065 micron SOI
463 million transistors |
| Die size | 285 mm2 |
| Data width | 64 bit |
| Number of cores | 4 |
| Floating Point Unit | Integrated |
| Level 1 cache size ? | 4 x 64 KB 2-way associative instruction cache
4 x 64 KB 2-way associative data cache |
| Level 2 cache size ? | 4 x 512 KB 8-way set associative cache |
| Level 3 cache size | 2 MB 32-way set associative shared cache |
| Physical memory | 256 TB |
| Multiprocessing | Up to 2 processors |
| Features | - MMX
- 3DNow!
- SSE
- SSE2
- SSE3
- SSE4a ?
- Advanced Bit Manipulation ?
- AMD64 technology ?
- AMD-V (virtualization) technology
- Enhanced Virus Protection ?
|
| Low power features | - Enhanced PowerNow! ?
- CoolCore technology ?
- Independent Dynamic Core Technology ?
- Dual Dynamic Power Management ?
- C1 Halt, C2 and C3 Stop Grant core states
- C1E Enhanced Stop Grant state
|
| On-chip peripherals | - Integrated dual-channel 144-bit DDR2 SDRAM Memory controller
- HyperTransport technology with three 16-bit links up to 1000 MHz each
|
| |
| Electrical/Thermal parameters |
| V core (V) ? | 1.125 |
| Average CPU Power (W) | 55 |
| Thermal Design Power (W) ? | 79 |
