Specifications
| General information |
| Type | CPU / Microprocessor |
| Market segment | Server |
| Family | AMD Third Generation Opteron |
| Model number ? | 8376 HE |
| CPU part number | OS8376PAL4DGI is an OEM/tray microprocessor |
| Frequency ? | 2300 MHz |
| Bus speed ? | 2000 MHz (integrated memory controller)
1000 MHz (HyperTransport links) |
| Package | 1207-land lidded LGA |
| Socket | Socket Fr2(1207) |
| Introduction date | Jan 26, 2009 |
| Price at introduction | $1514 |
| |
| Architecture / Microarchitecture |
| Microarchitecture | K10 |
| Processor core ? | Shanghai |
| Core stepping ? | C2 |
| Manufacturing process | 0.045 micron |
| Data width | 64 bit |
| The number of cores | 4 |
| The number of threads | 4 |
| Floating Point Unit | Integrated |
| Level 1 cache size ? | 4 x 64 KB 2-way associative instruction caches
4 x 64 KB 2-way associative data caches |
| Level 2 cache size ? | 4 x 512 KB 16-way associative caches |
| Level 3 cache size | 6 MB 48-way associative shared cache |
| Physical memory | 256 TB |
| Multiprocessing | Up to 8 processors |
| Features | - MMX
- 3DNow!
- SSE
- SSE2
- SSE3
- SSE4a ?
- Advanced Bit Manipulation ?
- AMD64 technology ?
- AMD-V (virtualization) technology
- Enhanced Virus Protection ?
|
| Low power features | - Enhanced PowerNow! ?
- CoolCore technology ?
- Independent Dynamic Core Technology ?
- Dual Dynamic Power Management ?
- Smart Fetch Technology
- C0, C1, S0, S1, S3, S4, and S5 states
|
| On-chip peripherals | - Integrated dual-channel 144-bit DDR2 SDRAM Memory controller
- HyperTransport technology with three 16-bit links
|
| |
| Electrical/Thermal parameters |
| V core ? | 1.2V |
| Minimum operating temperature | 0°C |
| Maximum operating temperature ? | 55°C - 76°C |
| Average CPU Power | 55 Watt |
| Thermal Design Power ? | 79 Watt |
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