AMD Athlon processor

750 MHz
Staggered ceramic PGA (Socket A/Socket 462)

850 MHz
200 Mhz bus speed
Staggered ceramic PGA (Socket A/Socket 462)

850 MHz
200 Mhz bus speed
Staggered ceramic PGA (Socket A/Socket 462)

Engineering sample

For each speed grade there were two versions of Athlon Thunderbird A processors with different core voltages. The processors with 'M' in the part number (like A0850AMT3B) had 1.75 core voltage. The processor with 'P' part numbers - like this A0850APT3B CPU - had core voltage 1.7 Volt. Due to lower core voltage, this processor war running slightly cooler that A0850AMT3B.

900 MHz
200 Mhz bus speed
Staggered ceramic PGA (Socket A/Socket 462)

950 MHz
Staggered ceramic PGA (Socket A/Socket 462)

1000 MHz
200 Mhz bus speed
Staggered ceramic PGA (Socket A/Socket 462)

1000 MHz
200 Mhz bus speed
Staggered organic PGA (Socket A/Socket 462)

This AMD Athlon 1000 microprocessor is quite different from other Thunderbird CPUs. This processor it packaged into organic Pin Grid Array package - that package became common in the next generation of Athlon XP microprocessors. Judging by the 26876 package number we can assume that this is one of the earliest versions of organic PGA packages. For comparison - the earliest Athlon XP packages are marked as 27100.

1000 MHz
266 Mhz bus speed
Staggered organic PGA (Socket A/Socket 462)

Engineering sample

1100 MHz
200 Mhz bus speed
Staggered ceramic PGA (Socket A/Socket 462)

1133 MHz
266 Mhz bus speed
Staggered ceramic PGA (Socket A/Socket 462)

All AMD Athlon processors, except the earlier ones, have 4 rubber pads located in package corners. The purpose of these pads is to prevent die substrate damage during installation of the fan/heatsink. Without the pads the die substrate could be easily cracked or chipped when a heatsink, which is not properly aligned to (not parallel to) die surface, is pushed down. The pads do not allow significant tilting of the heatsink, but even they cannot protect the die when excessive force is applied to the heatsink. Die substrate of this CPU shows typical damage which was caused by incorrect heatsink installation.

1200 MHz
200 Mhz bus speed
Staggered ceramic PGA (Socket A/Socket 462)

1300 MHz
200 Mhz bus speed
Staggered ceramic PGA (Socket A/Socket 462)

1333 MHz
266 Mhz bus speed
Staggered ceramic PGA (Socket A/Socket 462)