AMD Mobile Sempron 3200+ - SMS3200HAX4CM


Specifications

General information
TypeCPU / Microprocessor
Market segmentMobile
FamilyAMD Mobile Sempron
Model number  ? 3200+
CPU part numberSMS3200HAX4CM
Stepping codeLBBVF
Frequency (MHz)  ? 3200+ (rated)
1600 (real)
Package638-pin lidless micro-PGA
1.38" x 1.38" (3.5 cm x 3.5 cm)
SocketSocket S1
 
Architecture / Microarchitecture
Processor core  ? Keene
Core stepping  ? F2
Manufacturing process0.09 micron
Data width64 bit
Number of cores1
Floating Point UnitIntegrated
Level 1 cache size  ? 64 KB instruction cache
64 KB data cache
Level 2 cache size  ? 512 KB
Features
  • MMX Technology
  • 3DNow!
  • SSE
  • SSE2
  • SSE3
  • AMD64 technology  ? 
  • Enhanced Virus Protection  ? 
Low power featuresPowerNow! technology
On-chip peripherals
  • Dual-channel DDR2 SDRAM memory controller
  • One 16-bit HyperTransport link with speeds up to 800 MHz
 
Electrical/Thermal parameters
V core (V)  ? 1.125 / 1.15 / 1.2
Maximum operating temperature (°C)  ? 95
Thermal Design Power (W)  ? 25

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