AMD Mobile Sempron 3200+ - SMS3200HAX4CM
Specifications
| General information | |
| Type | CPU / Microprocessor |
| Market segment | Mobile |
| Family | AMD Mobile Sempron |
| Model number ? | 3200+ |
| CPU part number | SMS3200HAX4CM |
| Stepping code | LBBVF |
| Frequency (MHz) ? | 3200+ (rated) 1600 (real) |
| Package | 638-pin lidless micro-PGA 1.38" x 1.38" (3.5 cm x 3.5 cm) |
| Socket | Socket S1 |
| Architecture / Microarchitecture | |
| Processor core ? | Keene |
| Core stepping ? | F2 |
| Manufacturing process | 0.09 micron |
| Data width | 64 bit |
| Number of cores | 1 |
| Floating Point Unit | Integrated |
| Level 1 cache size ? | 64 KB instruction cache 64 KB data cache |
| Level 2 cache size ? | 512 KB |
| Features |
|
| Low power features | PowerNow! technology |
| On-chip peripherals |
|
| Electrical/Thermal parameters | |
| V core (V) ? | 1.125 / 1.15 / 1.2 |
| Maximum operating temperature (°C) ? | 95 |
| Thermal Design Power (W) ? | 25 |
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