| General information |
| Type | CPU / Microprocessor |
| Family | AMD Mobile Sempron |
| Model number ? | 3400+ |
| Part number | SMS3400HAX3CM |
| Stepping code | LEBAF |
| Frequency (MHz) ? | 3400+ (rated)
1800 (real) |
| Package | 638-pin lidless micro-PGA
1.38" x 1.38" (3.5 cm x 3.5 cm) |
| Socket | Socket S1 |
| |
| Architecture / Microarchitecture |
| Manufacturing process | 0.09 micron |
| Data width | 64 bit |
| Number of cores | 1 |
| Floating Point Unit | Integrated |
| Level 1 cache size ? | 64 KB instruction cache
64 KB data cache |
| Level 2 cache size ? | 256 KB |
| Features | - MMX Technology
- 3DNow!
- SSE
- SSE2
- SSE3
- AMD64 technology ?
- Enhanced Virus Protection ?
|
| Low power features | PowerNow! technology |
| On-chip peripherals | - Dual-channel DDR2 SDRAM memory controller
- One 16-bit HyperTransport link with speeds up to 800 MHz
|
| |
| Electrical/Thermal parameters |
| V core (V) ? | 1.125 / 1.15 / 1.2 |
| Max operating temperature (°C) ? | 95 |
| Thermal Design Power (W) ? | 25 |
| |
| Notes on AMD SMS3400HAX3CM |
|
