| General information |
| Type | CPU / Microprocessor |
| Family | AMD Mobile Sempron |
| Model number ? | 3800+ |
| CPU part number | SMD3800HAX3CM |
| Stepping codes | LFBAF LFBCF |
| Frequency (MHz) ? | 3800+ (rated)
2200 (real) |
| Package | 638-pin lidless micro-PGA
1.38" x 1.38" (3.5 cm x 3.5 cm) |
| Socket | Socket S1 |
| |
| Architecture / Microarchitecture |
| Processor core | Keene |
| Core stepping | F2 |
| Manufacturing process | 0.09 micron |
| Data width | 64 bit |
| Number of cores | 1 |
| Floating Point Unit | Integrated |
| Level 1 cache size ? | 64 KB instruction cache
64 KB data cache |
| Level 2 cache size ? | 256 KB |
| Features | - MMX Technology
- 3DNow!
- SSE
- SSE2
- SSE3
- AMD64 technology ?
- Enhanced Virus Protection ?
|
| Low power features | PowerNow! technology |
| On-chip peripherals | - Dual-channel DDR2 SDRAM memory controller
- One 16-bit HyperTransport link with speeds up to 800 MHz
|
| |
| Electrical/Thermal parameters |
| V core (V) ? | 1.2 / 1.225 / 1.275 |
| Maximum operating temperature (°C) ? | 95 |
| Thermal Design Power (W) ? | 31 |
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