| General information |
| Type | CPU / Microprocessor |
| Family | AMD Mobile Sempron |
| Model number ? | NI-52 |
| CPU part number | SMNI52DAM21GG |
| Frequency (MHz) ? | 1800 |
| Package | 638-pin lidless micro-PGA
1.38" x 1.38" (3.5 cm x 3.5 cm) |
| Socket | Socket S1 (S1g2) |
| Introduction date | Not released yet |
| |
| Architecture / Microarchitecture |
| Core stepping | B1 |
| Manufacturing process | 0.065 micron |
| Data width | 64 bit |
| Number of cores | 2 |
| Floating Point Unit | Integrated |
| Level 1 cache size ? | 64 KB instruction cache
64 KB data cache |
| Level 2 cache size ? | 256 KB |
| Features | - MMX Technology
- 3DNow!
- SSE
- SSE2
- SSE3
- AMD64 technology ?
- Enhanced Virus Protection ?
|
| Low power features | - Enhanced PowerNow! technology ?
- Independent Dynamic Core technology ?
- Dynamic Power management
- CoolCore technology ?
|
| On-chip peripherals | - Dual-channel DDR2 SDRAM memory controller
- HyperTransport technology ?
|
| |
| Electrical/Thermal parameters |
| V core (V) ? | 1.075 - 1.15 |
| Maximum operating temperature (°C) ? | 100 |
| Thermal Design Power (W) ? | 35 |
| |
| Notes on AMD SMNI52DAM21GG |
- Processor runs at 900 MHz / 0.95 Volt core voltage in the minimum performance state
- Thermal Design Power in the minimum performance state is 15.5 Watt
|
