| General information |
| Type | CPU / Microprocessor |
| Family | AMD Sempron for Ultrathin Notebooks |
| Model number ? | 210U |
| CPU part number | SMG210UOAX3DX |
| Frequency (MHz) ? | 1500 |
| Package | 812-ball lidless BGA
1.06" x 1.06" (2.7 cm x 2.7 cm) |
| Introduction date | Jan 15, 2009 |
| |
| Architecture / Microarchitecture |
| Manufacturing process | 0.065 micron SOI |
| Data width | 64 bit |
| Number of cores | 1 |
| Floating Point Unit | Integrated |
| Level 1 cache size ? | 64 KB instruction cache
64 KB data cache |
| Level 2 cache size ? | 256 KB |
| Physical memory | 1 TB |
| Virtual memory (TB) | 256 |
| Features | - MMX technology
- 3DNow!
- SSE
- SSE2
- SSE3
- AMD64 technology ?
|
| Low power features | PowerNow! Technology |
| On-chip peripherals | - Single-channel DDR2 SDRAM memory controller (up to DDR2-800)
- One 16-bit HyperTransport link with speeds up to 800 MHz
|
| |
| Electrical/Thermal parameters |
| Thermal Design Power (W) ? | 15 |
