| General information |
| Type | Highly Integrated microprocessor |
| Family | VIA Mark_CoreFusion |
| Part number | Mark CoreFusion 533MHz |
| Frequency (MHz) | 533 |
| Bus speed (MHz) ? | 133 |
| Clock multiplier ? | 4 |
| Package | 686-ball Ball Grid Array with Heat Spreader (HSBGA)
2.24" x 1.61" (5.7 cm c 1.4 cm) |
| Introduction date | Mar 12, 2003 |
| |
| Architecture / Microarchitecture |
| Processor core | Nehemiah |
| Manufacturing process | 0.13 micron |
| Data width | 32 bit |
| Floating Point Unit | Integrated |
| Level 2 cache size ? | 64 KB exclusive 16-way set associative cache |
| Features | - MMX technology
- 3DNow!
- SSE
- AES encryption
- Random Number Generator
|
| On-chip peripherals | - VIA ProSavage CLE266 north bridge
- S3 Graphics ProSavage4 2D/3D graphics controller
|
| |
| Electrical/Thermal parameters |
| V core (V) ? | 0.9 |
| Thermal Design Power (W) ? | 6 |
| |
| Notes on VIA Mark CoreFusion 533MHz |
- The processor supports 100/133 MHz SDRAM
- The CPU can be used with VIA 686B or VIA 8235M south bridge chipsets
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