VIA Mark CoreFusion 800MHz
Specifications
| General information | |
| Type | Highly Integrated microprocessor |
| Family | VIA Mark CoreFusion |
| HICPU part number | Mark CoreFusion 800MHz is an OEM/tray HICPU |
| Frequency (MHz) ? | 800 |
| Bus speed (MHz) ? | 133 |
| Clock multiplier ? | 6 |
| Package | 686-ball Ball Grid Array with Heat Spreader (HSBGA) 2.24" x 1.61" (5.7 cm c 1.4 cm) |
| Socket | BGA686 |
| Introduction date | Mar 12, 2003 |
| Architecture / Microarchitecture | |
| Processor core ? | Nehemiah |
| Manufacturing process | 0.13 micron |
| Data width | 32 bit |
| Floating Point Unit | Integrated |
| Level 2 cache size ? | 64 KB exclusive 16-way set associative cache |
| Features |
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| On-chip peripherals |
|
| Electrical/Thermal parameters | |
| V core (V) ? | 0.95 |
| Thermal Design Power (W) ? | 8 |
| Notes on VIA Mark CoreFusion 800MHz | |
| |
Pictures (2)
| Top view | |
800 MHz |
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| Bottom view | |
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