| General information |
| Type | CPU / Microprocessor |
| Frequency (MHz) ? | 200 |
| Bus speed (MHz) ? | 33 |
| Clock multiplier ? | 6 |
| Package | 352-terminal Ball Grid Array
1.378" x 1.378" (3.5 cm x 3.5 cm) |
| |
| Architecture / Microarchitecture |
| Manufacturing process | 0.35 micron 4-layer metal CMOS process |
| Data width | 32 bit |
| Floating Point Unit | Integrated |
| Level 1 cache size ? | 16 KB write-back 4-way set associative unified instruction and data cache |
| Physical memory (GB) | 1 |
| Features | MMX multimedia instructions |
| Low power features | - APM support
- CPU only suspend
- Suspend modulation
- Full 3V suspend
|
| On-chip peripherals | - PCI controller
- Display controller and 2D Graphics accelerator
- 64-bit synchronous DRAM controller
- Memory Management Unit
- Internal Bus Interface Unit
|
| |
| Electrical/Thermal parameters |
| V core (V) ? | 2.9 ± 0.15 |
| V I/O or secondary (V) | 3.3 ± 0.16 |
| Maximum operating temperature (°C) ? | 70 |
| Minimum/Typical/Maximum power dissipation (W) | 2.03 (Suspend mode) / 5.2 / 8.95 |
| |
| Notes |
- Interfaces with Cx5520 or Cx5530 companion chips
|
