| Microprocessor information |
|---|
| Type | Microprocessor |
| Manufacturing process | 0.35 micron 4-layer metal CMOS process |
| Data bus width | 32 bit |
| Package | 352-terminal Ball Grid Array
1.378" x 1.378" (3.5 cm x 3.5 cm) |
| Speed (MHz) | 200 |
| Bus frequency (MHz) | 33 |
| Clock multiplier | 6 |
| On-chip peripherals |
- PCI controller
- Display controller and 2D Graphics accelerator
- 64-bit synchronous DRAM controller
- Memory Management Unit
- Internal Bus Interface Unit
|
| Low power features |
- APM support
- CPU only suspend
- Suspend modulation
- Full 3V suspend
|
| Other features | MMX multimedia instructions |
| Physical memory (GB) | 1 |
| Level 1 cache size | 16 KB write-back 4-way set associative unified instruction and data cache |
| Floating Point Unit | Integrated |
| V core (V) | 2.9 ± 0.15 |
| V I/O or secondary (V) | 3.3 ± 0.16 |
| Max operating temperature (°C) | 85 |
| Min/Typical/Max power dissipation (W) | 2.03 (Suspend mode) / 5.2 / 8.95 |
Notes:- Interfaces with Cx5520 or Cx5530 companion chips
|
