Intel Pentium III processor family

Intel Pentium III 400 - 80525PZ400512
400 MHz (133 MHz bus)
512 KB L2 cache
Single Edge Contact cartridge 2 (slot 1)

Produced later than the DC1EC501A400 CPU this engineering sample has very significant feature - 133 MHz front side. Increasing front side bus speed from 100 MHz to 133 MHz allowed to increase processor performance by 5% - 10% on average.

It's worth to note that this processor was manufactured almost 11 months before the release of first Katmai processors with 133 MHz bus speed.

Intel Pentium III 600 - RB80526PZ600256 (BX80526C600256)

New generation of Intel Pentium III processors with Coppermine core featured not only better manufacturing technology (0.18 micron as opposed to 0.25 micron for Katmai core), but also different cache architecture and new package type. Smaller size of the new core allowed Intel to put level 2 cache on the the same die as the core. While new cache was two times smaller than the L2 cache on Katmai processors, it was twice as fast and had a few additional performance improvements. Because external cache chips were no longer required for the new core, it became possible to put the core on smaller and cheaper Flip-Chip Ping Grid Array package.

Intel Pentium III 750 - 80526PY750256 (BX80526U750256)

With the introduction of Coppermine core disappeared the main reason why cartridge-type packaging was required. Because Coppermine processors had integrated on-die 256 KB cache they could easily fit on small PGA package and no longer required bulky and more expensive cartridge. Nevertheless, to support huge base of Slot 1 motherboards Intel continued to release Coppermine Pentium III processors in SECC 2 (Slot 1) package. These processors had the same performance and other characteristics as socket 370 processors.

Intel Pentium III 1000 - RK80533PZ001256
1 GHz
256 KB L2 cache
370-pin FC-PGA2 package

Intel Pentium III 1000 - RK80530PZ001256 (BX80530C1000256)
1000 MHz
256 KB L2 cache
370-pin FC-PGA2

Intel Pentium III Xeon 667/256KB - 80526KZ667256 5/12V (BX80526KZ667256)

Pentium III Xeon family was manufactured using two different cores:

0.25 micron Xeon processors are based on Tanner core, which is very close to Pentium III Katmai core. The main difference between Tanner Xeons and Katmai Pentiums lies in the size and operating frequency of level 2 cache: the Xeon CPUs have much larger, up to 2 MB, L2 cache running at CPU frequency, that is twice as fast as Katmai L2 cache.

Next generation of Xeon processors was produced using 0.18 micro technology. There were two different versions of these processors - with 100 and 133 MHz Front Side Bus frequency. All Xeon microprocessors with 133 MHz FSB were in effect Pentium III Coppermine processors in Xeon package. Like desktop Pentium III CPUs, they had 256 KB level 2 cache integrated on the processor core and didn't support quad-processing. Performance of these Xeons was no better than performance of desktop processors. Later Intel released real Xeon processors that could work in 4-way systems and had very large, up to 2 MB, L2 cache. The disadvantage of these processors was lower FSB - only 100 MHz.

All Pentium 3 Xeon CPUs were packaged in the same bulky and heavy 330-contact SECC cartridge as Pentium II Xeons.

Intel Mobile Pentium III 1000 - KP80526GY001256 (BXM80526B001256)

Mobile Pentium III microprocessors in Ball Grid Array and micro Pin Grid Array packages included many features present on desktop Coppermine Pentium III CPUs. All mobile processors had 100 MHz Front Side Bus, 32 KB level 1 cache, 256 KB level 2 cache integrated with the core, and MMX and SSE instruction sets. The mobile microprocessors had slightly lower core voltage than desktop processors, and included additional power saving modes such as Quick Start and Deep Sleep. Majority of mobile CPUs also included SpeedStep mode. Mobile Pentium 3 processors were produced at speeds ranging from 400 MHz to 1 GHz.

Pentium III mobile modules are small circuit boards with a CPU, 82443BX north bridge, voltage regulator and MMC-2 connector. The 82443BX north bridge on the module integrates SDRAM memory controller, PCI and AGP bus interfaces. The CPU on the mobile module is a mobile Pentium III. Main features of these mobile processors are: 32 KB level 1 cache, integrated 256 KB level 2 cache, 100 MHz FSB frequency, support for SSE technology, Quick Start and other power-saving modes. Many mobile modules also support SpeedStep technology. The mobile module requires 12 Volt power supply - this voltage is converted by on-module voltage regulator to voltage required by the CPU (usually 1.6V), nortbridge chip and other module circuitry.

Intel Mobile Pentium III-M 1200 - RH80530GZ009512 / RH80530GZ00951E (BXM80530B120GD)

Intel Mobile Pentium III-M microprocessors were based on the last Pentium III core - Tualatin. These mobile processors featured a few performance enhancements such as larger size of L2 cache, data Prefetch Logic (DPL) feature and increased Front-Side Bus frequency. The mobile microprocessors had lower core voltage and power consumption than Mobile Pentium III CPUs based on Coppermine core. The mobile CPUs also had additional Deeper Sleep power-saving mode. Some OEM and all boxed Pentium III-M processors were packaged in 478-pin micro FC-PGA package. All other OEM mobile processors, including all low-voltage and ultra low voltage processors, were packaged in 479-ball micro FC-BGA package.