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Intel Mobile Pentium MMX 233 - TT80503233 (TT233)

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Intel Mobile Pentium MMX 233 MHz specifications

General information
TypeCPU / Microprocessor
Market segmentMobile
FamilyIntel Mobile Pentium MMX
CPU part numberTT80503233 is an OEM/tray microprocessor
Frequency  ? 233 MHz
Bus speed  ? 66 MHz
Clock multiplier  ? 3.5
Package320-pin Tape Carrier Package (TCP)
SocketTCP320
 
S-spec numbers
  ES/QS processors Production processors
Part number Q147 SL28Q
TT80503233++
 
Architecture / Microarchitecture
MicroarchitectureP5
Core stepping  ? myA0 (Q147, SL28Q)
CPUID581 (Q147, SL28Q)
Manufacturing process0.25 micron
Data width32 bit
Data bus width64 bit
Floating Point UnitIntegrated
Level 1 cache size  ? 16 KB 4-way set associative code cache
16 KB 4-way set associative write-back data cache
Physical memory4 GB
MultiprocessingNot supported
FeaturesMMX instructions
Low power features
  • System Management Mode
  • Clock Control
  • SL power-management features
On-chip peripherals
  • Memory Management Unit
  • Local Advanced Programmable Interrupt Controller
 
Electrical / Thermal parameters
Min/Recommended/Max V core1.665V / 1.8V / 1.935V
Min/Recommended/Max V I/O or secondary2.375V / 2.5V / 2.625V
Minimum/Maximum operating temperature  ? 0°C - 95°C
Minimum/Typical/Maximum power dissipation0.53 Watt (Stop Grant mode) / 3 Watt / 7 Watt
Thermal Design Power  ? 5.5 Watt
 
Notes on Intel TT80503233
  • Minimum bus frequency is 33 MHz

Detailed side-by-side comparison

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Mobile Pentium MMX 233 MHz Overclocking

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CPU ID information for the Mobile Pentium MMX 233 MHz

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CPUs, related to Intel Mobile Pentium MMX 233 MHz (TT80503233)

Model Frequency L1
cache
TDP Features  
Intel Mobile Pentium MMX family, TCP320
   Mobile Pentium MMX 120 MHz (TT80503120)120 MHz32 KB MMX>
   Mobile Pentium MMX 133 MHz (TT80503133)133 MHz32 KB7.8WMMX>
   Mobile Pentium MMX 150 MHz (TT80503150)150 MHz32 KB8.6WMMX>
   Mobile Pentium MMX 166 MHz (TT80503166 (0.25 micron))166 MHz32 KB4.1WMMX>
   Mobile Pentium MMX 166 MHz (TT80503166)166 MHz32 KB9WMMX>
   Mobile Pentium MMX 200 MHz (TT80503200)200 MHz32 KB5WMMX>
   Mobile Pentium MMX 233 MHz (TT80503233)233 MHz32 KB5.5WMMX 
   Mobile Pentium MMX 266 MHz (TT80503266)266 MHz32 KB7.6WMMX>
   Mobile Pentium MMX 300 MHz (TT80503300)300 MHz32 KB MMX>
Intel Mobile Pentium MMX family, P5 micro-architecture, Other sockets
   Mobile Pentium MMX 133 MHz (FV80503133)133 MHz32 KB7.8WMMX>
   Mobile Pentium MMX 150 MHz (FV80503150)150 MHz32 KB8.6WMMX>
   Mobile Pentium MMX 166 MHz (FV80503166 (mobile))166 MHz32 KB9WMMX>
   Mobile Pentium MMX 200 MHz (FV80503200 (mobile))200 MHz32 KB MMX>
   Mobile Pentium MMX 233 MHz (FV80503233 (mobile))233 MHz32 KB MMX>
Other families, P5 micro-architecture, TCP320
   Mobile Pentium 75 MHz (TT8050275)75 MHz16 KB6WMMX>
   Mobile Pentium 90 MHz (TT8050290)90 MHz16 KB7.3WMMX>
   Mobile Pentium 100 MHz (TT80502100)100 MHz16 KB8WMMX>
   Mobile Pentium 120 MHz (TT80502120)120 MHz16 KB7.1WMMX>
   Mobile Pentium 133 MHz (TT80502133)133 MHz16 KB7.9WMMX>
   Mobile Pentium 150 MHz (TT80502150)150 MHz16 KB10WMMX>
 • Highlighted numbers and features indicate whether specific processor performs better or worse than the Mobile Pentium MMX 233 MHz (TT80503233)
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 • Features abbreviations:
MMX - MMX instructions

Pictures (10)

Mounted on PGA adapter - Bottom view

233 MHz
Intel Mobile Pentium MMX 233 - TT80503233 (TT233)
Mounted on PGA adapter - Top view

233 MHz
Intel Mobile Pentium MMX 233 - TT80503233 (TT233)
Mounted on a board - Bottom view

233 MHz
Tape Carrier Package mounted on a board

Top view
Intel Mobile Pentium MMX 233 - TT80503233 (TT233)
Mounted on a board - Top view

233 MHz
Tape Carrier Package mounted on a board

Bottom view
Intel Mobile Pentium MMX 233 - TT80503233 (TT233)
TT80503233
2012-09-10 16:29:06
Posted by: andrzej_w_k

MMC1
TT80503233 - TT233 SL28Q
FW82439TX
+512kB cache L2
TT80503233
TT80503233
2012-09-10 16:31:11
Posted by: andrzej_w_k

MMC1
TT80503233 - TT233 SL28Q
FW82439TX
+512kB cache L2
TT80503233
TT80503233
2012-09-10 16:35:54
Posted by: andrzej_w_k

Opened CPU TT80503233
TT80503233
TT80503233
2012-09-10 16:37:46
Posted by: andrzej_w_k

CPU before packing
TT80503233
TT80503233
2012-09-10 16:44:29
Posted by: andrzej_w_k

TT80503233 in safe package :-)
TT80503233
TT80503233
2012-09-10 18:50:52
Posted by: andrzej_w_k

From Intel document 27315402 (or 273154-002) Mobile Pentium® Processor MMX™ Technology 0.25 Micron SmartDie foto from page 5

Die Revision: A-0 Step
Die Dimensions:
Mils: X = 356.8 ± 0.5, Y= 410.4 ± 0.5
Milimeters: X=9.06272 ± 0.0127, Y= 10.42416 ± 0.0127
Die Thickness: 17 ± 1 mils
Minimum Pad Pitch: 85 microns (3.346 mils)
Pad Passivation Opening Size:
Mils: 2.594 x 5.552 (single pads)
Microns: 65.89 x 141.02 (single pads)
Bond Pad Metallization:(outermost layer first)
17,850 Angstroms Aluminum (0.5% Copper), 1000 Angstroms Titanium
Pads (pins) per Die: 323
Die Backside Material:(outermost layer first)
1600 Angstroms Gold, 345 Angstroms Titanium
Passivation:(outermost layer first)
3.3 microns polyimide, 0.75 microns nitride
Intel Fabrication Process: CMOS (min. feature size 0.25 microns)
NOTE: The die specifications provided are valid for A-step die only.
TT80503233
Comments (1)

You're welcome to post suggestions, corrections, your own personal Intel Mobile Pentium MMX 233 MHz review, or your experience with the microprocessor. Please do not ask upgrade and troubleshooting questions, and do not start discussions.

TT80503233

2012-09-10 18:51:47
Posted by: andrzej_w_k

From Intel document 27315402 (or 273154-002) Mobile Pentium® Processor MMX™ Technology 0.25 Micron SmartDie foto from page 5

Die Revision: A-0 Step
Die Dimensions:
Mils: X = 356.8 ± 0.5, Y= 410.4 ± 0.5
Milimeters: X=9.06272 ± 0.0127, Y= 10.42416 ± 0.0127
Die Thickness: 17 ± 1 mils
Minimum Pad Pitch: 85 microns (3.346 mils)
Pad Passivation Opening Size:
Mils: 2.594 x 5.552 (single pads)
Microns: 65.89 x 141.02 (single pads)
Bond Pad Metallization:(outermost layer first)
17,850 Angstroms Aluminum (0.5% Copper), 1000 Angstroms Titanium
Pads (pins) per Die: 323
Die Backside Material:(outermost layer first)
1600 Angstroms Gold, 345 Angstroms Titanium
Passivation:(outermost layer first)
3.3 microns polyimide, 0.75 microns nitride
Intel Fabrication Process: CMOS (min. feature size 0.25 microns)
NOTE: The die specifications provided are valid for A-step die only.

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