Intel Mobile Pentium MMX 233 - TT80503233 (TT233)
Specifications
Tools
Intel Mobile Pentium MMX 233 MHz specifications
| General information | ||||||||||
| Type | CPU / Microprocessor | |||||||||
| Market segment | Mobile | |||||||||
| Family | Intel Mobile Pentium MMX | |||||||||
| CPU part number | TT80503233 is an OEM/tray microprocessor | |||||||||
| Frequency ? | 233 MHz | |||||||||
| Bus speed ? | 66 MHz | |||||||||
| Clock multiplier ? | 3.5 | |||||||||
| Package | 320-pin Tape Carrier Package (TCP) | |||||||||
| Socket | TCP320 | |||||||||
| S-spec numbers | ||||||||||
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| Architecture / Microarchitecture | ||||||||||
| Microarchitecture | P5 | |||||||||
| Core stepping ? | myA0 (Q147, SL28Q) | |||||||||
| CPUID | 581 (Q147, SL28Q) | |||||||||
| Manufacturing process | 0.25 micron | |||||||||
| Data width | 32 bit | |||||||||
| Data bus width | 64 bit | |||||||||
| Floating Point Unit | Integrated | |||||||||
| Level 1 cache size ? | 16 KB 4-way set associative code cache 16 KB 4-way set associative write-back data cache | |||||||||
| Physical memory | 4 GB | |||||||||
| Multiprocessing | Not supported | |||||||||
| Features | MMX instructions | |||||||||
| Low power features |
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| On-chip peripherals |
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| Electrical / Thermal parameters | ||||||||||
| Min/Recommended/Max V core | 1.665V / 1.8V / 1.935V | |||||||||
| Min/Recommended/Max V I/O or secondary | 2.375V / 2.5V / 2.625V | |||||||||
| Minimum/Maximum operating temperature ? | 0°C - 95°C | |||||||||
| Minimum/Typical/Maximum power dissipation | 0.53 Watt (Stop Grant mode) / 3 Watt / 7 Watt | |||||||||
| Thermal Design Power ? | 5.5 Watt | |||||||||
| Notes on Intel TT80503233 | ||||||||||
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CPUs, related to Intel Mobile Pentium MMX 233 MHz (TT80503233)
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• Features abbreviations:
Intel Mobile Pentium MMX 233 MHz Overclocking
Sorry, we do not have overclocking data for the microprocessor at this time.
Pictures (10)
| Mounted on PGA adapter - Bottom view | |
233 MHz |
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| Mounted on PGA adapter - Top view | |
233 MHz |
%20(top).jpg) |
| Mounted on a board - Bottom view | |
233 MHz Tape Carrier Package mounted on a board Top view |
%20(front).jpg) |
| Mounted on a board - Top view | |
233 MHz Tape Carrier Package mounted on a board Bottom view |
%20(back).jpg) |
| TT80503233 | |
MMC1 TT80503233 - TT233 SL28Q FW82439TX +512kB cache L2 |
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| TT80503233 | |
MMC1 TT80503233 - TT233 SL28Q FW82439TX +512kB cache L2 |
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| TT80503233 | |
Opened CPU TT80503233 |
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| TT80503233 | |
CPU before packing |
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| TT80503233 | |
TT80503233 in safe package :-) |
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| TT80503233 | |
From Intel document 27315402 (or 273154-002) Mobile Pentium® Processor MMX™ Technology 0.25 Micron SmartDie foto from page 5 Die Revision: A-0 Step Die Dimensions: Mils: X = 356.8 ± 0.5, Y= 410.4 ± 0.5 Milimeters: X=9.06272 ± 0.0127, Y= 10.42416 ± 0.0127 Die Thickness: 17 ± 1 mils Minimum Pad Pitch: 85 microns (3.346 mils) Pad Passivation Opening Size: Mils: 2.594 x 5.552 (single pads) Microns: 65.89 x 141.02 (single pads) Bond Pad Metallization:(outermost layer first) 17,850 Angstroms Aluminum (0.5% Copper), 1000 Angstroms Titanium Pads (pins) per Die: 323 Die Backside Material:(outermost layer first) 1600 Angstroms Gold, 345 Angstroms Titanium Passivation:(outermost layer first) 3.3 microns polyimide, 0.75 microns nitride Intel Fabrication Process: CMOS (min. feature size 0.25 microns) NOTE: The die specifications provided are valid for A-step die only. |
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CPU ID
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Comments (1)
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TT80503233
From Intel document 27315402 (or 273154-002) Mobile Pentium® Processor MMX™ Technology 0.25 Micron SmartDie foto from page 5
Die Revision: A-0 Step
Die Dimensions:
Mils: X = 356.8 ± 0.5, Y= 410.4 ± 0.5
Milimeters: X=9.06272 ± 0.0127, Y= 10.42416 ± 0.0127
Die Thickness: 17 ± 1 mils
Minimum Pad Pitch: 85 microns (3.346 mils)
Pad Passivation Opening Size:
Mils: 2.594 x 5.552 (single pads)
Microns: 65.89 x 141.02 (single pads)
Bond Pad Metallization:(outermost layer first)
17,850 Angstroms Aluminum (0.5% Copper), 1000 Angstroms Titanium
Pads (pins) per Die: 323
Die Backside Material:(outermost layer first)
1600 Angstroms Gold, 345 Angstroms Titanium
Passivation:(outermost layer first)
3.3 microns polyimide, 0.75 microns nitride
Intel Fabrication Process: CMOS (min. feature size 0.25 microns)
NOTE: The die specifications provided are valid for A-step die only.
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