| Chip information |
|---|
| Type | Microprocessor |
| Manufacturing process | 0.35 micron 5-layer metal CMOS process
2.6 million transistors |
| Data bus width | 32 bit |
| Package | 255-ball ceramic BGA
0.83“ x 0.83“ (2.1 cm x 2.1 cm) |
| Speed (MHz) | 200 |
| Bus frequency (MHz) | 25 – 66 |
| Clock multiplier | 3 (at 66 MHz bus) |
| On-chip peripherals |
- Instruction Memory Management Unit
- Data Memory Memory Management Unit
|
| Low power features |
- Dynamic power management mode
- Doze mode
- Nap mode
- Sleep mode
|
| Physical memory (GB) | 4 |
| Virtual memory (TB) | 4096 |
| Level 1 cache size | 16 KB 4-way set-associative instruction cache
16 KB 4-way set-associative data cache |
| Floating Point Unit | Integrated |
| V core (V) | 2.5 ± 5% |
| V I/O or secondary (V) | 3.3 ± 5% |
| Min/Max operating temperature (°C) | 0 - 105 |
| Min/Typical/Max power dissipation (W) | 0.12 (Nap mode) / 4 / 5 |
Notes:- Minimum processor frequency is 125 MHz
|
