| General information |
| Type | CPU / Microprocessor |
| Frequency (MHz) ? | 180 |
| Bus speed (MHz) ? | 25 – 66 |
| Clock multiplier ? | 3 (at 60 MHz bus) |
| Package | 255-ball ceramic BGA
0.83“ x 0.83“ (2.1 cm x 2.1 cm) |
| |
| Architecture / Microarchitecture |
| Manufacturing process | 0.35 micron 5-layer metal CMOS process
2.6 million transistors |
| Die size | 79 (10.5 x 7.5) mm2 |
| Data width | 32 bit |
| Floating Point Unit | Integrated |
| Level 1 cache size ? | 16 KB 4-way set-associative instruction cache
16 KB 4-way set-associative data cache |
| Physical memory (GB) | 4 |
| Virtual memory (TB) | 4096 |
| Low power features | - Doze mode
- Nap mode
- Sleep mode ?
- Dynamic power management mode
|
| On-chip peripherals | - Instruction Memory Management Unit
- Data Memory Memory Management Unit
|
| |
| Electrical/Thermal parameters |
| V core (V) ? | 2.5 ± 5% |
| V I/O or secondary (V) | 3.3 ± 5% |
| Minimum/Maximum operating temperature (°C) ? | 0 - 105 |
| Minimum/Typical/Maximum power dissipation (W) | 0.1 (Nap mode) / 3.5 / 4.5 |
| |
| Notes |
- Minimum processor frequency is 125 MHz
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