| General information |
| Type | CPU / Microprocessor |
| Frequency (MHz) ? | 200 |
| Bus speed (MHz) ? | 66 |
| Clock multiplier ? | 3 |
| Package | 296-pin Staggered Ceramic Pin Grid Array, 1.95" x 1.95" (4.95 cm x 4.95 cm) |
| Socket | Socket 7 |
| |
| Architecture / Microarchitecture |
| Manufacturing process | 0.25 and 0.35 5-layer metal CMOS technology |
| Die size | 58 mm2 (0.25 micron) mm2 |
| Data width | 32 bit |
| Floating Point Unit | Integrated |
| Level 1 cache size ? | 32 KB 2-way set associative code cache
32 KB 4-way set associative data cache |
| Multiprocessing | N |
| Features | - MMX technology
- 3DNow! Technology
|
| Low power features | - STOP CLOCK state
- STOP GRANT state ?
- STOP CLOCK SNOOP state
- AUTOHALT state ?
- Dynamic power management - on-chip arrays, selected datapaths and associated control is powered down when not in use
|
| |
| Electrical/Thermal parameters |
| Min/Recommended/Max V core (V) | 3.45 / 3.52 / 3.6 |
| Minimum/Maximum operating temperature (°C) ? | 0 - 70 |
| Minimum/Maximum power dissipation (W) ? | 2 (Stop Clock mode) / 12 |
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