| Type | Microprocessor |
| Manufacturing process | 0.25 micron 5-layer metal CMOS technology |
| Data bus width | 32 bit |
| Package | 296-pin Staggered Ceramic Pin Grid Array, 1.95" x 1.95" (4.95 cm x 4.95 cm) |
| Socket | Socket 7 |
| Speed (MHz) | 266 |
| Bus frequency (MHz) | 66 |
| Clock multiplier | 4 |
| Low power features |
- STOP CLOCK state
- STOP GRANT state
- STOP CLOCK SNOOP state
- AUTOHALT state
- Dynamic power management - on-chip arrays, selected datapaths and associated control is powered down when not in use
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| Other features |
- MMX technology
- 3DNow! Technology
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| Level 1 cache size | 32 KB 2-way set associative code cache
32 KB 4-way set associative data cache |
| Floating Point Unit | Integrated |
| Min/Recommended/Max V core (V) | 3.135 / 3.3 / 3.6 |
| Min/Max operating temperature (°C) | 0 - 70 |
| Min/Max power dissipation (W) | 1 (Stop Clock mode) / 10.5 |
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