| General information |
| Type | CPU / Microprocessor |
| Family | Intel Xeon |
| Model number ? | W3570 |
| CPU part number | AT80601000918AB (SLBES) |
| Box part number | BX80601W3570 |
| Frequency (MHz) ? | 3200 |
| Bus speed (MHz) ? | 3200 MHz QPI |
| Package | 1366-land Flip-Chip Land Grid Array (FC-LGA8)
1.77" x 1.67" (4.5 cm x 4.25 cm) |
| Socket | Socket 1366 (LGA1366) |
| Introduction date | Mar 29, 2009 |
| Price at introduction | $999 |
| |
| Architecture / Microarchitecture |
| Processor core | Bloomfield |
| Core stepping | D0 (SLBES) |
| Manufacturing process | 0.045 micron |
| Data width | 64 bit |
| Number of cores | 4 |
| Floating Point Unit | Integrated |
| Level 1 cache size ? | 4 x 32 KB instruction caches
4 x 32 KB data caches |
| Level 2 cache size ? | 4 x 256 KB |
| Level 3 cache size | 8 MB |
| Physical memory (GB) | 24 |
| Multiprocessing | Uniprocessor |
| Features | - MMX instruction set
- SSE
- SSE2
- SSE3
- Supplemental SSE3
- SSE4.1 ?
- SSE4.2 ?
- EM64T technology ?
- Virtualization technology
- Execute Disable bit ?
- Turbo Boost Technology ?
- Hyper-Threading technology
|
| Low power features | - Thread C1/C1E, C3 and C6 states
- Core C1/C1E, C3 and C6 states
- Package C1/C1E, C3 and C6 states
- Enhanced SpeedStep technology ?
|
| On-chip peripherals | - Integrated 3-channel DDR3 SDRAM Memory controller
- Quick Path Interconnect
|
| |
| Electrical/Thermal parameters |
| V core (V) ? | 0.8 - 1.375 |
| Minimum/Maximum operating temperature (°C) ? | 5 - 67.9 |
| Minimum/Maximum power dissipation (W) ? | 12 (TDP in C6 state) / 224.42 |
| Thermal Design Power (W) ? | 130 |
| |
| Notes on Intel AT80601000918AB |
- Memory controller supports DDR3-800, DDR3-1066 and DDR3-1333 memory
|
