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AMD K6, K6-2 and K6-III identification
K6 | K6-2 and K6-III | x86 chips | Geode | K7 Athlon, Athlon XP and Athlon MP | Duron | Sempron | Opteron and Athlon 64 | Mobile Athlon 64 and Turion 64 | Phenom and Third Generation Opteron | Other AMD families
| To identify AMD K6 processor use the part number from the top of the chip. For interpretation of the part number please see the table below. Some information like core voltage and I/O voltage, that you can determine from the part number, is also printed on the processor. If core voltage and/or I/O voltage are different from what you deduce from the part number then use the printed values for voltages, not the data from the table below. To determine when the CPU was manufactured take a look at the datecode.
First two digits of the datecode is the year when the processor was manufactured.
Remaining two digits of the datecode is the week number when the CPU was manufactured.
For example, the processor on the picture was manufactured on the 33th week of 1997. |
|
| 1 | 2 | 3 | 4 | 5 | |||||
| AMD- | K6 | - / |
200 | A | L | R | |||
| 5. Maximum operating temperature | |||||||||
| R | 70°C | ||||||||
| Z | 85°C | ||||||||
| 4. Voltage | |||||||||
| C | 2.0V ± 0.1V core/3.135-3.6V I/O | ||||||||
| D | 2.1V ± 0.1V core/3.135-3.6V I/O | ||||||||
| F | 2.2V ± 0.1V core/3.135-3.6V I/O | ||||||||
| L | 2.9V ± 0.1V core/3.135-3.6V I/O | ||||||||
| N | 3.2V ± 0.145V core/3.135-3.6V I/O | ||||||||
| P | 3.3V ± 0.1V core/3.135-3.6V I/O | ||||||||
| 3. Package type | |||||||||
| A | 321-pin ceramic PGA | ||||||||
| B | 360-ball ceramic BGA (mobile processors only) | ||||||||
| 2. Frequency | |||||||||
| 166 | 166 MHz | ||||||||
| 200 | 200 MHz | ||||||||
| 233 | 233 MHz | ||||||||
| 250 | 250 MHz | ||||||||
| 266 | 266 MHz | ||||||||
| 300 | 300 MHz | ||||||||
| 1. Part number | |||||||||
| K6 | K6 processor | ||||||||
| 1 | 2 | 3 | 4 | 5 | 6 | |||||
| AMD- | K6-2 | / | 300 | A | F | R | -66 | |||
| 6. Bus speed (optional) | ||||||||||
| -66 | Processor requires 66 MHz bus speed | |||||||||
| 5. Maximum operating temperature | ||||||||||
| K | 80°C | |||||||||
| Q | 60°C | |||||||||
| R | 70°C | |||||||||
| X | 65°C | |||||||||
| Z | 85°C | |||||||||
| 4. Voltage | ||||||||||
| C | 2.0V ± 0.1V core / 3.135-3.6V I/O | |||||||||
| D | 2.1V ± 0.1V core / 3.135-3.6V I/O | |||||||||
| F | 2.2V ± 0.1V core / 3.135-3.6V I/O | |||||||||
| G | 2.3V ± 0.1V core / 3.135-3.6V I/O | |||||||||
| H | 2.4V ± 0.1V core / 3.135-3.6V I/O | |||||||||
| M | 1.9V ± 0.1V core / 3.135-3.6V I/O | |||||||||
| N | 1.8V ± 0.1V core / 3.135-3.6V I/O | |||||||||
| T | 1.6V ± 0.1V core / 3.135-3.6V I/O | |||||||||
| P | 1.7V ± 0.1V core / 3.135-3.6V I/O | |||||||||
| U | 1.5V ± 0.1V core / 3.135-3.6V I/O | |||||||||
| 3. Package type | ||||||||||
| A | 321-pin ceramic PGA | |||||||||
| B | 360-ball ceramic BGA (mobile processors only) | |||||||||
| I | 349-ball organic BGA (embedded processors only) | |||||||||
| 2. Frequency (MHz) | ||||||||||
| 1. Part number | ||||||||||
| K6-2 | K6-2 processor | |||||||||
| K6-2E | Embedded version of K6-2 processor | |||||||||
| K6-2+ | K6-2+ processor with 128 KB L2 cache | |||||||||
| K6-2E+ | Embedded version of K6-2 processor with 128 KB L2 cache | |||||||||
| K6-III | K6-III processor | |||||||||
| K6-III+ | K6-III+ processor | |||||||||
| K6-IIIE+ | Embedded version of K6-III+ processor | |||||||||
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