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AMD identification


General naming convention for old chips | 290x | 29100 | 29000, 29030, 29040 and 29050 | Z800x | 8051 | 8080 and 8085 | 8080 and 8085 (alternative markings) | 9511 FPU | 9761 microcontroller | x86 chips | Geode | K6, K6-2 and K6-III | K7 Athlon, Athlon XP and Athlon MP | Duron | Sempron | Opteron and Athlon 64 | Mobile Athlon 64 and Turion 64

  General naming convention for old chips identification  
  1 2 3 4 5  
Am 9080A -2 D M B  
   
5. Screening
Blank    Standard screening
B   Burn-in screening
 
  4. Temperature range
C   Commercial range 0 - +70°C
M   Military range -55 - +125°C
 
    3. Package type
D   Ceramic DIP
F   Flatpack
L   Ceramic LCC
P   Plastic DIP
X   Dice
 
  2. Frequency identifier or frequency in MHz
 
  1. Part number

  290x identification  
Related links: 2901
  1 2 3 4  
Am 2901 D C B  
   
4. Screening
Blank    Standard screening
B   Burn-in screening
-B   Burn-in screening
 
  3. Temperature range
C   Commercial range 0 - +70°C
M   Military range -55 - +125°C
 
    2. Package type
D   Ceramic DIP
F   Flatpack
L   Ceramic LCC
P   Plastic DIP
X   Dice
 
      1. Part number
2901   2901 bit slice processor
2901A   2901A bit slice processor
2901B   2901B bit slice processor
2901C   2901C bit slice processor (faster version of 2901B)
2903   2903 bit-slice processor, enhanced verion of AMD 2901
2903A   2903A bit-slice processor, enhanced verion of AMD 2901
2909A   Microprogram sequencer
2910A   Microprogram controller
2911   Microprogram sequencer
2911A   Microprogram sequencer
29203   29203 bit-slice processor, improved version of AMD 2903

  29100 identification  
Related links: 29100
  1 2 3 4  
Am 29116 D C B  
   
4. Screening
Blank    Standard screening
B   Burn-in screening
 
  3. Temperature range
C   Commercial range 0 - +70°C
M   Military range -55 - +125°C
 
    2. Package type
D   Ceramic DIP
L   Chip-pak
X   Dice
 
      1. Part number
29116   29116 microprocessor

  29000, 29030, 29040 and 29050 identification  
Related links: 29000 | 29030 | 29040
  1   2 3 4 5  
Am 29030 - 25 G C /W  
     
5. Optional processing (QFP only)
Blank    non-trimmed or formed package
/W   Trimmed and formed package
 
  4. Temperature range
C   Commercial range 0 - +85°C
I   Industrial range -40 - +125°C
 
    3. Package type
G   Ceramic PGA
F   144-pin ceramic QFP
K   168-pin plastic QFP
 
      2. Frequency
16   16 MHz
20   20 MHz
25   25 MHz
33   33 MHz
40   40 MHz
50   50 MHz
 
          1. Part number
29000   29000 RISC microprocessor
29005   Low-cost version of 29000 CPU
29030   29030 RISC microprocessor
29035   29030 RISC microprocessor with reduced L1 cache size
29040   29040 RISC microprocessor
29050   29050 RISC microprocessor with integrated FPU

  Z800x identification  
Related links: Z800x
  1 2 3 4 5  
AmZ
Z		 8001 A D M B  
   
5. Screening
Blank    Standard screening
B   Burn-in screening
 
  4. Temperature range
C   Commercial range 0 - +70°C
I   Industrial range -40 - +85°C
M   Military range -55 - +125°C
 
    3. Package type
D   Ceramic side-brazed DIP
L   Leadless Chip Carrier
P   Plastic DIP
 
      2. Frequency
Blank   4 MHz
A   6 MHz
A-8   8 MHz
 
        1. Part number
8001   8001 segmented CPU
8002   8002 non-segmented CPU

  8051 identification  
Related links: 8051
1 2 3 4 5  
I D 8051AH -15 B  
 
5. Screening
Blank    Standard screening
B   Burn-in screening
 
  4. Frequency (MHz)
Blank   12 MHz
-8   8 MHz
-15   15 MHz
 
    3. Part number
8031   8031 microcontroller without ROM
8051   8051 microcontroller with 4 KB masked ROM
8031AH   8031 microcontroller without ROM
8051AH   8051 microcontroller with 4 KB masked ROM
8751H   8751 microcontroller with 4 KB EPROM
 
      2. Package type
D   Ceramic DIP
J   Plastic LCC
L   Ceramic LCC
N   Plastic LCC
P   Plastic DIP
 
        1. Temperature range
Blank   Commercial range 0 - +70°C
I   Industrial range -40 - +85°C
M   Military range -55 - +125°C

  8080 and 8085 identification  
Related links: 8080 | 8085
  1 2 3 4 5  
Am 9080A -2 D C B  
   
5. Screening
Blank    Standard screening
B   Burn-in screening
-B   Burn-in screening
 
  4. Temperature range
C   Commercial range 0 - +70°C
I   Industrial range -40 - +85°C
M   Military range -55 - +125°C
 
    3. Package type
C   Ceramic DIP
D   Side-brazed ceramic DIP
P   Plastic DIP
 
      2. Frequency
Blank   3 MHz (8085A, 9085A), 2MHz (9080A)
-1   6 MHz (8085A, 9085A), 3.1 MHz (9080A)
-2   5 MHz (8085A, 9085A), 2.6 MHz (9080A)
 
        1. Part number
8085A   8085A processor
9085A   8085A processor
9080A   8080A processor

  8080 and 8085 (alternative markings) identification  
Related links: 8080 | 8085
1 2 3 4 5  
I D 8085AH -2 B  
 
5. Screening
Blank    Standard screening
B   Burn-in screening
 
  4. Frequency
Blank   2 MHz (8080A), 3 MHz (8085A, 8085AH)
-1   3.1 MHz (8080A), 6 MHz (8085A, 8085AH)
-2   2.6 MHz (8080A), 5 MHz (8085A, 8085AH)
 
    3. Part number
8080A   8080 CPU
8085A   8085 CPU (enhanced version of 8080 CPU)
8085AH   8085 CPU
 
      2. Package type
D   Ceramic DIP
J   Plastic LCC
N   Plastic LCC
P   Plastic DIP
 
        1. Temperature range
Blank   Commercial range 0 - +70°C
I   Industrial range -40 - +85°C
M   Military range -55 - +125°C

  9511 FPU identification  
Related links: 9511
  1 2 3 4 5  
Am 9511A -1 D I B  
   
5. Screening
Blank    Standard screening
B   Burn-in screening
 
  4. Temperature range
C   Commercial range 0 - +70°C
I   Industrial range -40 - +85°C
 
    3. Package type
D   Ceramic DIP
J   Plastic LCC
L   Ceramic LCC
P   Plastic DIP
 
      2. Frequency
Blank   2 MHz
-1   3 MHz
-4   4 MHz
 
        1. Part number
9511A   9511 arithmetic processor
9512   9512 arithmetic processor

  9761 microcontroller identification  
  1 2 3 4 5  
AM 9761H D I B  
   
5. Screening
Blank    Standard screening
B   Burn-in screening
 
  4. Temperature range
Blank   Commercial range 0 - +70°C
I   Industrial range -40 - +85°C
 
    3. Package type
D   Ceramic DIP
J   Plastic LCC
L   Ceramic LCC
P   Plastic DIP
 
      2. Frequency (MHz)
Blank   12 MHz
 
        1. Part number
9761H   8751-compatible microcontroller with 8 KB EPROM

Last modified: 2 Apr 2008
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