|
Intel identification
3002 | 4004 and 4040 | 8008 | 8080 | 8085 | MCS-48 | MCS-51 | MCS-96 | 8086, 8087 and 8088 | 80186, 80C186, 80188 and 80C188 | 80C187 | 80286 | 80287 | 80386 and 80387 | 80860 | 80960 | SA-110 | 80486 | Pentium | Pentium II | Pentium III | Modern Intel CPUs
3002 identification
| 1 | 2 | 3 | |
| M | D | 3001 | |
| |
| 3. Part number |
| 3001 | Microprogram Control Unit |
| 3002 | Bit-slice processor |
| |
| | 2. Package type |
| D | Ceramic DIP |
| C | side-brazed ceramic DIP |
| |
| | | 1. Temperature range |
| Blank | Commercial range |
| M | Military range |
4004 and 4040 identification
| 1 | 2 | |
| D | 4004 | |
| |
| 2. Part number |
| 4004 | 4004 processor |
| 4040 | Enhanced version of Intel 4004 microprocessor |
| |
| | 1. Package type |
| C | Side-brazed ceramic DIP |
| D | Ceramic DIP |
| P | Plastic DIP |
8008 identification
| 1 | 2 | 3 | |
| D | 8008 | -1 | |
| |
| 3. Frequency |
| Blank | 500 KHz |
| -1 | 800 KHz |
| |
| | 2. Part number |
| 8008 | 8008 processor |
| |
| | | 1. Package type |
| C | Side-brazed ceramic DIP |
| D | Ceramic DIP |
| P | Plastic DIP |
8080 identification
| 1 | 2 | 3 | 4 | |
| | D | 8080A | -1 | |
| |
| 4. Frequency |
| Blank | 2 MHz |
| -1 | 3.1 MHz |
| -2 | 2.6 MHz |
| |
| | 3. Part number |
| 8080 | 8080 processor |
| 8080A | 8080 processor |
| |
| | | 2. Package type |
| C | Side-brazed ceramic DIP |
| D | Ceramic DIP |
| P | Plastic DIP |
| |
| | | | 1. Temperature range |
| Blank | Commercial range 0 - +70°C |
| Q | Commercial temperature range 0 - 70°C, burn-in screening |
| M | Military range -55 - +125°C |
8085 identification
| 1 | 2 | 3 | 4 | |
| | D | 8085AH | -2 | |
| |
| 4. Frequency |
| Blank | 3 MHz |
| -1 | 6 MHz |
| -2 | 5 MHz |
| |
| | 3. Part number |
| 8085 | 8085 processor |
| 8085A | 8085 processor |
| 8085AH | HMOS version of 8085 processor |
| |
| | | 2. Package type |
| C | Side-brazed ceramic DIP |
| D | Ceramic DIP |
| P | Plastic DIP |
| |
| | | | 1. Temperature range |
| Blank | Commercial range 0 - +70°C |
| L | Extended temperature range -40 - 85°C, burn-in screening |
| Q | Commercial temperature range 0 - 70°C, burn-in screening |
| T | Extended temperature range -40 - 85°C, no burn-in screening |
| M | Military range -55 - +125°C |
MCS-48 identification
| 1 | 2 | 3 | 4 | 5 | 6 | |
| | D | 8035 | | L | -8 | |
| |
| 6. Frequency |
| Blank | 6 MHz for 8035/8048/8748 NMOS parts, 11 MHz for all others |
| -6 | 6 MHz |
| -8 | 3.6 MHz |
| |
| | 5. Power down mode |
| Blank | Unspecified. Power down mode is supported in HMOS parts, and not supported in NMOS parts. |
| L | The microcontroller supports power down mode. |
| |
| | | 4. Manufacturing technology |
| Blank | N-channel silicon-gate MOS |
| H | N-channel silicon-gate HMOS process (HMOS-E for 8748 and 8749). |
| AH | N-channel silicon-gate HMOS process |
| |
| | | | 3. Part number |
| 8035 | 8048-compatible microcontroller with 64 bytes of RAM and without ROM |
| 8039 | 8048-compatible microcontroller with 128 bytes of RAM and without ROM |
| 8040 | 8048-compatible microcontroller with 256 bytes of RAM and without ROM |
| 8048 | 8048 microcontroller with 64 bytes of RAM and 1 KB masked ROM |
| 8049 | 8048-compatible microcontroller with 128 bytes of RAM and 2 KB masked ROM |
| 8050 | 8048-compatible microcontroller with 256 bytes of RAM and 4 KB masked ROM |
| 8748 | 8048-compatible microcontroller with 64 bytes of RAM and 1 KB EPROM |
| 8749 | 8048-compatible microcontroller with 128 bytes of RAM and 2 KB EPROM |
| |
| | | | | 2. Package type |
| D | 40-pin ceramic DIP |
| N | 44-pin plastic LCC |
| P | 40-pin plastic DIP |
| |
| | | | | | 1. Temperature range and screening (optional) |
| Blank | Commercial range 0 - +70°C, no additional screening |
| L | Extended temperature range -40 - 85°C, burn-in screening |
| Q | Commercial temperature range 0 - 70°C, burn-in screening |
| T | Extended temperature range -40 - 85°C, no burn-in screening |
MCS-51 identification
| 1 | 2 | 3 | 4 | |
| | D | 8751H | -8 | |
| |
| 4. Frequency (MHz) or frequency identifier |
| Blank | 8 MHz for KB parts, 12 MHz for H/AH/BH parts |
| -1 | 16 MHz |
| -2 | 0.5 MHz - 12 MHz |
| -8 | 8 MHz |
| -20 | 20 MHz |
| |
| | 3. Part number |
| 8031AH | 8051-compatible microcontroller with 128 bytes RAM and without ROM |
| 8031KB | 8051-compatible microcontroller with 128 bytes RAM and without ROM |
| 8032AH | 8051-compatible microcontroller with 256 bytes RAM and without ROM |
| 80C31BH | 8051-compatible CMOS microcontroller with 128 bytes RAM and without ROM |
| 8051AH | 8051 microcontroller with 128 bytes RAM and 4 KB masked ROM |
| 8051AHP | 8051 microcontroller with memory protection, 128 bytes RAM and 4 KB masked ROM |
| 8051KB | 8051 microcontroller with 128 bytes RAM and 4 KB masked ROM |
| 8052AH | 8051-compatible microcontroller with 256 bytes RAM and 8 KB masked ROM |
| 80C51BH | 8051 CMOS microcontroller with 128 bytes RAM and 4 KB masked ROM |
| 80C51BHP | 8051 CMOS microcontroller with memory protection, 128 bytes RAM and 4 KB masked ROM |
| 8751H | 8051 microcontroller with 128 bytes RAM and 4 KB EPROM |
| 8751BH | 8051 microcontroller with 128 bytes RAM and 4 KB EPROM |
| 8752BH | 8051 microcontroller with 256 bytes RAM and 8 KB EPROM |
| 87C51 | 8051 microcontroller with 128 bytes RAM and 4 KB EPROM |
| |
| | | 2. Package type |
| D | 40-pin ceramic DIP |
| N | 44-pin plastic LCC |
| P | 40-pin plastic DIP |
| R | Ceramic LCC |
| S | 44-pin plastic QFP |
| |
| | | | 1. Temperature range and screening (optional) |
| Blank | Commercial range 0 - +70°C, no additional screening |
| A | Automotive temperature range -40 - 125°C, no burn-in screening |
| B | Automotive temperature range -40 - 125°C, burn-in screening |
| L | Extended temperature range -40 - 85°C, burn-in screening |
| Q | Commercial temperature range 0 - 70°C, burn-in screening |
| T | Extended temperature range -40 - 85°C, no burn-in screening |
MCS-96 identification
| 1 | 2 | 3 | 4 | 5 | 6 | |
| A | N | 87 | C | 196 | KR | |
| |
| 6. MCU features |
| JQ | 12KB EPROM, 360 bytes of registry RAM, 128 bytes of code RAM |
| JR | 16KB EPROM, 488 bytes of registry RAM, 256 bytes of code RAM |
| JT | 32KB EPROM, 1KB of registry RAM, 512 bytes of code RAM |
| JV | 48KB EPROM, 1.5KB of registry RAM, 512 bytes of code RAM |
| KQ | 12KB EPROM, 360 bytes of registry RAM, 128 bytes of code RAM |
| KR | 16KB EPROM, 488 bytes of registry RAM, 256 bytes of code RAM |
| |
| | 5. Microcontroller family |
| 196 | MCS-96 |
| |
| | | 4. Manufacturing technology |
| C | CMOS |
| |
| | | | 3. On-chip program memory (ROM) |
| 80 | ROMless |
| 83 | Masked ROM |
| 87 | EPROM, OTP or QROM |
| |
| | | | | 2. Package type |
| N | plastic LCC |
| |
| | | | | | 1. Temperature range and screening |
| A | Automotive temperature range -40 - +125°C, standard burn-in screening |
8086, 8087 and 8088 identification
| 1 | 2 | 3 | 4 | |
| | C | 8087 | -1 | |
| |
| 4. Frequency |
| Blank | 5 MHz |
| -1 | 10 MHz |
| -2 | 8 MHz |
| |
| | 3. Part number |
| 8086 | 8086 processor |
| 80C86 | CMOS version of 8086 processor |
| 8087 | Co-processor for 8086/8088 processors |
| 8088 | 8086 processor with external 8-bit data bus |
| |
| | | 2. Package type |
| C | Ceramic side-brazed DIP |
| D | Ceramic DIP |
| P | Plastic DIP |
| |
| | | | 1. Temperature range and screening (optional) |
| Blank | Commercial range 0 - +70°C, no additional screening |
| L | Extended temperature range -40 - 85°C, burn-in screening |
| Q | Commercial temperature range 0 - 70°C, burn-in screening |
| T | Extended temperature range -40 - 85°C, no burn-in screening |
80186, 80C186, 80188 and 80C188 identification
| 1 | 2 | 3 | | 4 | |
| T | A | 80186 | - | 6 | |
| |
| 4. Frequency |
| Blank | 8 MHz |
| 6 | 6 MHz |
| 8 | 8 MHz |
| 10 | 10 MHz |
| 12 | 12.5 MHz |
| 13 | 13 MHz |
| 16 | 16 MHz |
| 20 | 20 MHz |
| 25 | 25 MHz |
| |
| | | 3. Part number |
| 80186 | 80186 microprocessor |
| 80C186 | CMOS version of 80186 microprocessor |
| 80C186XL | 80C186 microprocessor with enhanced features |
| 80C186EA | 80C186 compatible microprocessor with extra features |
| 80C186EB | 80C186 compatible microprocessor with extra features |
| 80C186EC | 80C186 compatible microprocessor with extra features |
| 80188 | 80188 microprocessor (80186 with external 8 bit data bus) |
| 80C188 | CMOS version of 80188 CPU |
| 80C188XL | 80C188 microprocessor with enhanced features |
| 80C188EA | 80C188 compatible microprocessor with extra features |
| 80C188EB | 80C188 compatible microprocessor with extra features |
| 80C188EC | 80C188 compatible microprocessor with extra features |
| |
| | | | 2. Package type |
| A | Ceramic PGA |
| C | Ceramic LCC |
| CG | Ceramic PGA |
| KU | Plastic QFP |
| N | Plastic LCC |
| R | Ceramic LCC |
| S | QFP |
| SB | SQFP |
| |
| | | | | 1. Operating temperature and/or screening |
| Blank | Commercial temperature range 0 - 70°C |
| Q | Commercial temperature range 0 - 70°C, burn-in screening |
| T | Extended temperature range -40 - 85°C, no burn-in screening |
80C187 identification
| 1 | 2 | 3 | |
| D | 80C187 | 16 | |
| |
| 3. Frequency |
| 12 | 12 MHz |
| 16 | 16 MHz |
| |
| | 2. Part number |
| 80C187 | Co-processor for 80C186 family of processors |
| |
| | | 1. Package type |
| D | Ceramic DIP |
| N | Plastic LCC |
80286 identification
| 1 | 2 | 3 | |
| A | 80286 | -6 | |
| |
| 3. Frequency |
| -6 | 6 MHz |
| -8 | 8 MHz |
| -10 | 10 MHz |
| -12 | 12.5 MHz |
| |
| | 2. Part number |
| 80286 | 80286 microprocessor |
| |
| | | 1. Package type |
| A | Ceramic PGA |
| C | Ceramic LCC |
| CG | Ceramic PGA |
| N | Plastic LCC |
| R | Ceramic LCC |
80287 identification
| 1 | 2 | 3 | |
| C | 80287 | -3 | |
| |
| 3. Frequency |
| -3 | 5 MHz |
| -6 | 6 MHz |
| -8 | 8 MHz |
| -10 | 10 MHz |
| -12 | 12.5 MHz |
| |
| | 2. Part number |
| 80287 | Co-processor for 80286 family of processors |
| |
| | | 1. Package type |
| C | Ceramic side-brazed DIP |
| D | Ceramic DIP |
80386 and 80387 identification
| 1 | 2 | 3 | 4 | | 5 | |
| A | 80386 | DX | -33 | | IV | |
| |
| 5. Manufacturing technology |
| Not specified | CHMOS III (80386) |
| IV | CHMOS IV |
| |
| | | 4. Frequency |
| -16 | 16 MHz |
| -20 | 20 MHz |
| -25 | 25 MHz |
| -33 | 33 MHz |
| |
| | | | 3. Data bus width |
| Blank | 32-bit external data bus (same as DX) |
| DX | 32-bit external data bus |
| EX | Embedded version of 80386 processor |
| SX | 16-bit external data bus |
| |
| | | | | 2. Part number |
| 80386 | 80386 microprocessor |
| 80387 | Co-processor for 80386 family of processors |
| |
| | | | | | 1. Package type |
| A | Ceramic PGA |
| N | Plastic LCC |
| NG | Plastic QFP |
80860 identification
| 1 | 2 | | 3 | |
| A | 80860XP | - | 50 | |
| |
| 3. Frequency (MHz) |
| 25 | 25 MHz |
| 33 | 33 MHz |
| 40 | 40 MHz |
| 50 | 50 MHz |
| |
| | | 2. Part number |
| 80860XP | Improved version of 80860 microprocessor with multiprocessor support |
| 80860XR | 80860 32-bit microprocessor |
| |
| | | | 1. Package type |
| A | Staggered ceramic PGA |
80960 identification
| 1 | 2 | 3 | 4 | | 5 | |
| A | 80960 | HT | 3V | - | 133 | |
| |
| 5. Frequency (MHz) |
| |
| | | 4. Core voltage |
| 3V | 3.3V |
| |
| | | | 3. Processor features |
| CA | Superscalar 32-bit processor |
| CF | Superscalar 32-bit processor |
| HA | High performance superscalar 32-bit processor |
| HD | High performance superscalar 32-bit processor running at 2x bus speed |
| HT | High performance superscalar 32-bit processor running at 3x bus speed |
| KA | Cost-effective 32-bit processor |
| KB | Cost-effective 32-bit processor |
| MC | Cost-effective 32-bit processor |
| JA | Low power 32-bit processor |
| JC | Low power 32-bit processor running at 2x bus speed |
| JD | Low power 32-bit processor |
| JF | Low power 32-bit processor |
| JS | Low power 32-bit processor |
| JT | Low power 32-bit processor running at 3x bus speed |
| RD | 32-bit I/O processor |
| RM | 32-bit I/O processor |
| RN | 32-bit I/O processor |
| RP | 32-bit I/O processor |
| RS | 32-bit I/O processor |
| SA | Cost-effective 32-bit processor |
| SB | Cost-effective 32-bit processor |
| VH | 32-bit processor with integrated PCI interface |
| |
| | | | | 2. Part number |
| 80959 | 80960 processor with additional debugging capabilities |
| 80960 | 80960 processor |
| |
| | | | | | 1. Package type |
| A | Staggered ceramic PGA |
| FC | Shrink QFP |
| FW | 324-ball PBGA |
| GD | 196-ball PBGA |
| KU | Plastic QFP |
| N | Plastic LCC |
| NG | 132-lead plastic QFP |
| S | 80-lead QFP |
| TA | Staggered ceramic PGA (extended temperature) |
| TG | Plastic QFP (extended temperature) |
| TN | Plastic LCC (extended temperature) |
SA-110 identification
| 1 | | 2 | |
| SA-110 | | 21281-EB | |
| |
| 2. Frequency |
| 21281-AB | 160 MHz |
| 21281-BB | 100 MHz |
| 21281-CB | 200 MHz |
| 21281-DB | 166 MHz |
| 21281-EB | 233 MHz |
| 21281-FB | 233 MHz |
| |
| | | 1. Part number |
| SA-110 | SA-110 StrongArm processor |
|
|