Intel identification

3002 | 4004 and 4040 | 8008 | 8080 | 8085 | MCS-48 | MCS-51 | MCS-96 | 8086, 8087 and 8088 | 80186, 80C186, 80188 and 80C188 | 80C187 | 80286 | 80287 | 80386 and 80387 | 80860 | 80960 | SA-110 | 80486 | Pentium | Pentium II | Pentium III | Modern Intel CPUs

1	2	3
M	D	3001
			3. Part number
			3001	Microprogram Control Unit
			3002	Bit-slice processor
			2. Package type
			D	Ceramic DIP
			C	side-brazed ceramic DIP
			1. Temperature range
			Blank	Commercial range
			M	Military range

1	2
D	4004
		2. Part number
		4004	4004 processor
		4040	Enhanced version of Intel 4004 microprocessor
		1. Package type
		C	Side-brazed ceramic DIP
		D	Ceramic DIP
		P	Plastic DIP

1	2	3
D	8008	-1
			3. Frequency
			Blank	500 KHz
			-1	800 KHz
			2. Part number
			8008	8008 processor
			1. Package type
			C	Side-brazed ceramic DIP
			D	Ceramic DIP
			P	Plastic DIP

1	2	3	4
	D	8080A	-1
				4. Frequency
				Blank	2 MHz
				-1	3.1 MHz
				-2	2.6 MHz
				3. Part number
				8080	8080 processor
				8080A	8080 processor
				2. Package type
				C	Side-brazed ceramic DIP
				D	Ceramic DIP
				P	Plastic DIP
				1. Temperature range
				Blank	Commercial range 0 - +70°C
				Q	Commercial temperature range 0 - 70°C, burn-in screening
				M	Military range -55 - +125°C

1	2	3	4
	D	8085AH	-2
				4. Frequency
				Blank	3 MHz
				-1	6 MHz
				-2	5 MHz
				3. Part number
				8085	8085 processor
				8085A	8085 processor
				8085AH	HMOS version of 8085 processor
				2. Package type
				C	Side-brazed ceramic DIP
				D	Ceramic DIP
				P	Plastic DIP
				1. Temperature range
				Blank	Commercial range 0 - +70°C
				L	Extended temperature range -40 - 85°C, burn-in screening
				Q	Commercial temperature range 0 - 70°C, burn-in screening
				T	Extended temperature range -40 - 85°C, no burn-in screening
				M	Military range -55 - +125°C

1	2	3	4	5	6
	D	8035		L	-8
						6. Frequency
						Blank	6 MHz for 8035/8048/8748 NMOS parts, 11 MHz for all others
						-6	6 MHz
						-8	3.6 MHz
						5. Power down mode
						Blank	Unspecified. Power down mode is supported in HMOS parts, and not supported in NMOS parts.
						L	The microcontroller supports power down mode.
						4. Manufacturing technology
						Blank	N-channel silicon-gate MOS
						H	N-channel silicon-gate HMOS process (HMOS-E for 8748 and 8749).
						AH	N-channel silicon-gate HMOS process
						3. Part number
						8035	8048-compatible microcontroller with 64 bytes of RAM and without ROM
						8039	8048-compatible microcontroller with 128 bytes of RAM and without ROM
						8040	8048-compatible microcontroller with 256 bytes of RAM and without ROM
						8048	8048 microcontroller with 64 bytes of RAM and 1 KB masked ROM
						8049	8048-compatible microcontroller with 128 bytes of RAM and 2 KB masked ROM
						8050	8048-compatible microcontroller with 256 bytes of RAM and 4 KB masked ROM
						8748	8048-compatible microcontroller with 64 bytes of RAM and 1 KB EPROM
						8749	8048-compatible microcontroller with 128 bytes of RAM and 2 KB EPROM
						2. Package type
						D	40-pin ceramic DIP
						N	44-pin plastic LCC
						P	40-pin plastic DIP
						1. Temperature range and screening (optional)
						Blank	Commercial range 0 - +70°C, no additional screening
						L	Extended temperature range -40 - 85°C, burn-in screening
						Q	Commercial temperature range 0 - 70°C, burn-in screening
						T	Extended temperature range -40 - 85°C, no burn-in screening

1	2	3	4
	D	8751H	-8
				4. Frequency (MHz) or frequency identifier
				Blank	8 MHz for KB parts, 12 MHz for H/AH/BH parts
				-1	16 MHz
				-2	0.5 MHz - 12 MHz
				-8	8 MHz
				-20	20 MHz
				3. Part number
				8031AH	8051-compatible microcontroller with 128 bytes RAM and without ROM
				8031KB	8051-compatible microcontroller with 128 bytes RAM and without ROM
				8032AH	8051-compatible microcontroller with 256 bytes RAM and without ROM
				80C31BH	8051-compatible CMOS microcontroller with 128 bytes RAM and without ROM
				8051AH	8051 microcontroller with 128 bytes RAM and 4 KB masked ROM
				8051AHP	8051 microcontroller with memory protection, 128 bytes RAM and 4 KB masked ROM
				8051KB	8051 microcontroller with 128 bytes RAM and 4 KB masked ROM
				8052AH	8051-compatible microcontroller with 256 bytes RAM and 8 KB masked ROM
				80C51BH	8051 CMOS microcontroller with 128 bytes RAM and 4 KB masked ROM
				80C51BHP	8051 CMOS microcontroller with memory protection, 128 bytes RAM and 4 KB masked ROM
				8751H	8051 microcontroller with 128 bytes RAM and 4 KB EPROM
				8751BH	8051 microcontroller with 128 bytes RAM and 4 KB EPROM
				8752BH	8051 microcontroller with 256 bytes RAM and 8 KB EPROM
				87C51	8051 microcontroller with 128 bytes RAM and 4 KB EPROM
				2. Package type
				D	40-pin ceramic DIP
				N	44-pin plastic LCC
				P	40-pin plastic DIP
				R	Ceramic LCC
				S	44-pin plastic QFP
				1. Temperature range and screening (optional)
				Blank	Commercial range 0 - +70°C, no additional screening
				A	Automotive temperature range -40 - 125°C, no burn-in screening
				B	Automotive temperature range -40 - 125°C, burn-in screening
				L	Extended temperature range -40 - 85°C, burn-in screening
				Q	Commercial temperature range 0 - 70°C, burn-in screening
				T	Extended temperature range -40 - 85°C, no burn-in screening

1	2	3	4	5	6
A	N	87	C	196	KR
						6. MCU features
						JQ	12KB EPROM, 360 bytes of registry RAM, 128 bytes of code RAM
						JR	16KB EPROM, 488 bytes of registry RAM, 256 bytes of code RAM
						JT	32KB EPROM, 1KB of registry RAM, 512 bytes of code RAM
						JV	48KB EPROM, 1.5KB of registry RAM, 512 bytes of code RAM
						KQ	12KB EPROM, 360 bytes of registry RAM, 128 bytes of code RAM
						KR	16KB EPROM, 488 bytes of registry RAM, 256 bytes of code RAM
						5. Microcontroller family
						196	MCS-96
						4. Manufacturing technology
						C	CMOS
						3. On-chip program memory (ROM)
						80	ROMless
						83	Masked ROM
						87	EPROM, OTP or QROM
						2. Package type
						N	plastic LCC
						1. Temperature range and screening
						A	Automotive temperature range -40 - +125°C, standard burn-in screening

1	2	3	4
	C	8087	-1
				4. Frequency
				Blank	5 MHz
				-1	10 MHz
				-2	8 MHz
				3. Part number
				8086	8086 processor
				80C86	CMOS version of 8086 processor
				8087	Co-processor for 8086/8088 processors
				8088	8086 processor with external 8-bit data bus
				2. Package type
				C	Ceramic side-brazed DIP
				D	Ceramic DIP
				P	Plastic DIP
				1. Temperature range and screening (optional)
				Blank	Commercial range 0 - +70°C, no additional screening
				L	Extended temperature range -40 - 85°C, burn-in screening
				Q	Commercial temperature range 0 - 70°C, burn-in screening
				T	Extended temperature range -40 - 85°C, no burn-in screening

1	2	3		4
T	A	80186	-	6
					4. Frequency
					Blank	8 MHz
					6	6 MHz
					8	8 MHz
					10	10 MHz
					12	12.5 MHz
					13	13 MHz
					16	16 MHz
					20	20 MHz
					25	25 MHz
					3. Part number
					80186	80186 microprocessor
					80C186	CMOS version of 80186 microprocessor
					80C186XL	80C186 microprocessor with enhanced features
					80C186EA	80C186 compatible microprocessor with extra features
					80C186EB	80C186 compatible microprocessor with extra features
					80C186EC	80C186 compatible microprocessor with extra features
					80188	80188 microprocessor (80186 with external 8 bit data bus)
					80C188	CMOS version of 80188 CPU
					80C188XL	80C188 microprocessor with enhanced features
					80C188EA	80C188 compatible microprocessor with extra features
					80C188EB	80C188 compatible microprocessor with extra features
					80C188EC	80C188 compatible microprocessor with extra features
					2. Package type
					A	Ceramic PGA
					C	Ceramic LCC
					CG	Ceramic PGA
					KU	Plastic QFP
					N	Plastic LCC
					R	Ceramic LCC
					S	QFP
					SB	SQFP
					1. Operating temperature and/or screening
					Blank	Commercial temperature range 0 - 70°C
					Q	Commercial temperature range 0 - 70°C, burn-in screening
					T	Extended temperature range -40 - 85°C, no burn-in screening

1	2	3
D	80C187	16
			3. Frequency
			12	12 MHz
			16	16 MHz
			2. Part number
			80C187	Co-processor for 80C186 family of processors
			1. Package type
			D	Ceramic DIP
			N	Plastic LCC

1	2	3
A	80286	-6
			3. Frequency
			-6	6 MHz
			-8	8 MHz
			-10	10 MHz
			-12	12.5 MHz
			2. Part number
			80286	80286 microprocessor
			1. Package type
			A	Ceramic PGA
			C	Ceramic LCC
			CG	Ceramic PGA
			N	Plastic LCC
			R	Ceramic LCC

1	2	3
C	80287	-3
			3. Frequency
			-3	5 MHz
			-6	6 MHz
			-8	8 MHz
			-10	10 MHz
			-12	12.5 MHz
			2. Part number
			80287	Co-processor for 80286 family of processors
			1. Package type
			C	Ceramic side-brazed DIP
			D	Ceramic DIP

1	2	3	4		5
A	80386	DX	-33		IV
						5. Manufacturing technology
						Not specified	CHMOS III (80386)
						IV	CHMOS IV
						4. Frequency
						-16	16 MHz
						-20	20 MHz
						-25	25 MHz
						-33	33 MHz
						3. Data bus width
						Blank	32-bit external data bus (same as DX)
						DX	32-bit external data bus
						EX	Embedded version of 80386 processor
						SX	16-bit external data bus
						2. Part number
						80386	80386 microprocessor
						80387	Co-processor for 80386 family of processors
						1. Package type
						A	Ceramic PGA
						N	Plastic LCC
						NG	Plastic QFP

1	2		3
A	80860XP	-	50
				3. Frequency (MHz)
				25	25 MHz
				33	33 MHz
				40	40 MHz
				50	50 MHz
				2. Part number
				80860XP	Improved version of 80860 microprocessor with multiprocessor support
				80860XR	80860 32-bit microprocessor
				1. Package type
				A	Staggered ceramic PGA

1	2	3	4		5
A	80960	HT	3V	-	133
						5. Frequency (MHz)
						4. Core voltage
						3V	3.3V
						3. Processor features
						CA	Superscalar 32-bit processor
						CF	Superscalar 32-bit processor
						HA	High performance superscalar 32-bit processor
						HD	High performance superscalar 32-bit processor running at 2x bus speed
						HT	High performance superscalar 32-bit processor running at 3x bus speed
						KA	Cost-effective 32-bit processor
						KB	Cost-effective 32-bit processor
						MC	Cost-effective 32-bit processor
						JA	Low power 32-bit processor
						JC	Low power 32-bit processor running at 2x bus speed
						JD	Low power 32-bit processor
						JF	Low power 32-bit processor
						JS	Low power 32-bit processor
						JT	Low power 32-bit processor running at 3x bus speed
						RD	32-bit I/O processor
						RM	32-bit I/O processor
						RN	32-bit I/O processor
						RP	32-bit I/O processor
						RS	32-bit I/O processor
						SA	Cost-effective 32-bit processor
						SB	Cost-effective 32-bit processor
						VH	32-bit processor with integrated PCI interface
						2. Part number
						80959	80960 processor with additional debugging capabilities
						80960	80960 processor
						1. Package type
						A	Staggered ceramic PGA
						FC	Shrink QFP
						FW	324-ball PBGA
						GD	196-ball PBGA
						KU	Plastic QFP
						N	Plastic LCC
						NG	132-lead plastic QFP
						S	80-lead QFP
						TA	Staggered ceramic PGA (extended temperature)
						TG	Plastic QFP (extended temperature)
						TN	Plastic LCC (extended temperature)

1		2
SA-110		21281-EB
			2. Frequency
			21281-AB	160 MHz
			21281-BB	100 MHz
			21281-CB	200 MHz
			21281-DB	166 MHz
			21281-EB	233 MHz
			21281-FB	233 MHz
			1. Part number
			SA-110	SA-110 StrongArm processor