3002 identification
| 1 |
2 |
3 |
|
| M |
D |
3001 |
|
| |
| 3. Part number |
| 3001 |
|
Microprogram Control Unit |
| 3002 |
|
Bit-slice processor |
| |
| |
2. Package type |
| D |
|
Ceramic DIP |
| C |
|
side-brazed ceramic DIP |
| |
| |
|
1. Temperature range |
| Blank |
|
Commercial range |
| M |
|
Military range |
4004 and 4040 identification
| 1 |
2 |
|
| D |
4004 |
|
| |
| 2. Part number |
| 4004 |
|
4004 processor |
| 4040 |
|
Enhanced version of Intel 4004 microprocessor |
| |
| |
1. Package type |
| C |
|
Side-brazed ceramic DIP |
| D |
|
Ceramic DIP |
| P |
|
Plastic DIP |
8008 identification
| 1 |
2 |
3 |
|
| D |
8008 |
-1 |
|
| |
| 3. Frequency |
| Blank |
|
500 KHz |
| -1 |
|
800 KHz |
| |
| |
2. Part number |
| 8008 |
|
8008 processor |
| |
| |
|
1. Package type |
| C |
|
Side-brazed ceramic DIP |
| D |
|
Ceramic DIP |
| P |
|
Plastic DIP |
8080 identification
| 1 |
2 |
3 |
4 |
|
| |
D |
8080A |
-1 |
|
| |
| 4. Frequency |
| Blank |
|
2 MHz |
| -1 |
|
3.1 MHz |
| -2 |
|
2.6 MHz |
| |
| |
3. Part number |
| 8080 |
|
8080 processor |
| 8080A |
|
8080 processor |
| |
| |
|
2. Package type |
| C |
|
Side-brazed ceramic DIP |
| D |
|
Ceramic DIP |
| P |
|
Plastic DIP |
| |
| |
|
|
1. Temperature range |
| Blank |
|
Commercial range 0 - +70°C |
| Q |
|
Commercial temperature range 0 - 70°C, burn-in screening |
| M |
|
Military range -55 - +125°C |
8085 identification
| 1 |
2 |
3 |
4 |
|
| |
D |
8085AH |
-2 |
|
| |
| 4. Frequency |
| Blank |
|
3 MHz |
| -1 |
|
6 MHz |
| -2 |
|
5 MHz |
| |
| |
3. Part number |
| 8085 |
|
8085 processor |
| 8085A |
|
8085 processor |
| 8085AH |
|
HMOS version of 8085 processor |
| |
| |
|
2. Package type |
| C |
|
Side-brazed ceramic DIP |
| D |
|
Ceramic DIP |
| P |
|
Plastic DIP |
| |
| |
|
|
1. Temperature range |
| Blank |
|
Commercial range 0 - +70°C |
| L |
|
Extended temperature range -40 - 85°C, burn-in screening |
| Q |
|
Commercial temperature range 0 - 70°C, burn-in screening |
| T |
|
Extended temperature range -40 - 85°C, no burn-in screening |
| M |
|
Military range -55 - +125°C |
MCS-48 identification
| 1 |
2 |
3 |
4 |
5 |
6 |
|
| |
D |
8035 |
|
L |
-8 |
|
| |
| 6. Frequency |
| Blank |
|
6 MHz for 8035/8048/8748 NMOS parts, 11 MHz for all others |
| -6 |
|
6 MHz |
| -8 |
|
3.6 MHz |
| |
| |
5. Power down mode |
| Blank |
|
Unspecified. Power down mode is supported in HMOS parts, and not supported in NMOS parts. |
| L |
|
The microcontroller supports power down mode. |
| |
| |
|
4. Manufacturing technology |
| Blank |
|
N-channel silicon-gate MOS |
| H |
|
N-channel silicon-gate HMOS process (HMOS-E for 8748 and 8749). |
| AH |
|
N-channel silicon-gate HMOS process |
| |
| |
|
|
3. Part number |
| 8035 |
|
8048-compatible microcontroller with 64 bytes of RAM and without ROM |
| 8039 |
|
8048-compatible microcontroller with 128 bytes of RAM and without ROM |
| 8040 |
|
8048-compatible microcontroller with 256 bytes of RAM and without ROM |
| 8048 |
|
8048 microcontroller with 64 bytes of RAM and 1 KB masked ROM |
| 8049 |
|
8048-compatible microcontroller with 128 bytes of RAM and 2 KB masked ROM |
| 8050 |
|
8048-compatible microcontroller with 256 bytes of RAM and 4 KB masked ROM |
| 8748 |
|
8048-compatible microcontroller with 64 bytes of RAM and 1 KB EPROM |
| 8749 |
|
8048-compatible microcontroller with 128 bytes of RAM and 2 KB EPROM |
| |
| |
|
|
|
2. Package type |
| D |
|
40-pin ceramic DIP |
| N |
|
44-pin plastic LCC |
| P |
|
40-pin plastic DIP |
| |
| |
|
|
|
|
1. Temperature range and screening (optional) |
| Blank |
|
Commercial range 0 - +70°C, no additional screening |
| L |
|
Extended temperature range -40 - 85°C, burn-in screening |
| Q |
|
Commercial temperature range 0 - 70°C, burn-in screening |
| T |
|
Extended temperature range -40 - 85°C, no burn-in screening |
MCS-51 identification
| 1 |
2 |
3 |
4 |
|
| |
D |
8751H |
-8 |
|
| |
| 4. Frequency (MHz) or frequency identifier |
| Blank |
|
8 MHz for KB parts, 12 MHz for H/AH/BH parts |
| -1 |
|
16 MHz |
| -2 |
|
0.5 MHz - 12 MHz |
| -8 |
|
8 MHz |
| -20 |
|
20 MHz |
| |
| |
3. Part number |
| 8031AH |
|
8051-compatible microcontroller with 128 bytes RAM and without ROM |
| 8031KB |
|
8051-compatible microcontroller with 128 bytes RAM and without ROM |
| 8032AH |
|
8051-compatible microcontroller with 256 bytes RAM and without ROM |
| 80C31BH |
|
8051-compatible CMOS microcontroller with 128 bytes RAM and without ROM |
| 8051AH |
|
8051 microcontroller with 128 bytes RAM and 4 KB masked ROM |
| 8051AHP |
|
8051 microcontroller with memory protection, 128 bytes RAM and 4 KB masked ROM |
| 8051KB |
|
8051 microcontroller with 128 bytes RAM and 4 KB masked ROM |
| 8052AH |
|
8051-compatible microcontroller with 256 bytes RAM and 8 KB masked ROM |
| 80C51BH |
|
8051 CMOS microcontroller with 128 bytes RAM and 4 KB masked ROM |
| 80C51BHP |
|
8051 CMOS microcontroller with memory protection, 128 bytes RAM and 4 KB masked ROM |
| 8751H |
|
8051 microcontroller with 128 bytes RAM and 4 KB EPROM |
| 8751BH |
|
8051 microcontroller with 128 bytes RAM and 4 KB EPROM |
| 8752BH |
|
8051 microcontroller with 256 bytes RAM and 8 KB EPROM |
| 87C51 |
|
8051 microcontroller with 128 bytes RAM and 4 KB EPROM |
| |
| |
|
2. Package type |
| D |
|
40-pin ceramic DIP |
| N |
|
44-pin plastic LCC |
| P |
|
40-pin plastic DIP |
| R |
|
Ceramic LCC |
| S |
|
44-pin plastic QFP |
| |
| |
|
|
1. Temperature range and screening (optional) |
| Blank |
|
Commercial range 0 - +70°C, no additional screening |
| A |
|
Automotive temperature range -40 - 125°C, no burn-in screening |
| B |
|
Automotive temperature range -40 - 125°C, burn-in screening |
| L |
|
Extended temperature range -40 - 85°C, burn-in screening |
| Q |
|
Commercial temperature range 0 - 70°C, burn-in screening |
| T |
|
Extended temperature range -40 - 85°C, no burn-in screening |
8086, 8087 and 8088 identification
| 1 |
2 |
3 |
4 |
|
| |
C |
8087 |
-1 |
|
| |
| 4. Frequency |
| Blank |
|
5 MHz |
| -1 |
|
10 MHz |
| -2 |
|
8 MHz |
| |
| |
3. Part number |
| 8086 |
|
8086 processor |
| 80C86 |
|
CMOS version of 8086 processor |
| 8087 |
|
Co-processor for 8086/8088 processors |
| 8088 |
|
8086 processor with external 8-bit data bus |
| |
| |
|
2. Package type |
| C |
|
Ceramic side-brazed DIP |
| D |
|
Ceramic DIP |
| P |
|
Plastic DIP |
| |
| |
|
|
1. Temperature range and screening (optional) |
| Blank |
|
Commercial range 0 - +70°C, no additional screening |
| L |
|
Extended temperature range -40 - 85°C, burn-in screening |
| Q |
|
Commercial temperature range 0 - 70°C, burn-in screening |
| T |
|
Extended temperature range -40 - 85°C, no burn-in screening |
80186, 80C186, 80188 and 80C188 identification
| 1 |
2 |
3 |
|
4 |
|
| T |
A |
80186 |
- |
6 |
|
| |
|
| 4. Frequency |
| Blank |
|
8 MHz |
| 6 |
|
6 MHz |
| 8 |
|
8 MHz |
| 10 |
|
10 MHz |
| 12 |
|
12.5 MHz |
| 13 |
|
13 MHz |
| 16 |
|
16 MHz |
| 20 |
|
20 MHz |
| 25 |
|
25 MHz |
| |
| |
|
3. Part number |
| 80186 |
|
80186 microprocessor |
| 80C186 |
|
CMOS version of 80186 microprocessor |
| 80C186XL |
|
80C186 microprocessor with enhanced features |
| 80C186EA |
|
80C186 compatible microprocessor with extra features |
| 80C186EB |
|
80C186 compatible microprocessor with extra features |
| 80C186EC |
|
80C186 compatible microprocessor with extra features |
| 80188 |
|
80188 microprocessor (80186 with external 8 bit data bus) |
| 80C188 |
|
CMOS version of 80188 CPU |
| 80C188XL |
|
80C188 microprocessor with enhanced features |
| 80C188EA |
|
80C188 compatible microprocessor with extra features |
| 80C188EB |
|
80C188 compatible microprocessor with extra features |
| 80C188EC |
|
80C188 compatible microprocessor with extra features |
| |
| |
|
|
2. Package type |
| A |
|
Ceramic PGA |
| C |
|
Ceramic LCC |
| CG |
|
Ceramic PGA |
| KU |
|
Plastic QFP |
| N |
|
Plastic LCC |
| R |
|
Ceramic LCC |
| S |
|
QFP |
| SB |
|
SQFP |
| |
| |
|
|
|
1. Operating temperature and/or screening |
| Blank |
|
Commercial temperature range 0 - 70°C |
| Q |
|
Commercial temperature range 0 - 70°C, burn-in screening |
| T |
|
Extended temperature range -40 - 85°C, no burn-in screening |
80C187 identification
| 1 |
2 |
3 |
|
| D |
80C187 |
16 |
|
| |
| 3. Frequency |
| 12 |
|
12 MHz |
| 16 |
|
16 MHz |
| |
| |
2. Part number |
| 80C187 |
|
Co-processor for 80C186 family of processors |
| |
| |
|
1. Package type |
| D |
|
Ceramic DIP |
| N |
|
Plastic LCC |
80286 identification
| 1 |
2 |
3 |
|
| A |
80286 |
-6 |
|
| |
| 3. Frequency |
| -6 |
|
6 MHz |
| -8 |
|
8 MHz |
| -10 |
|
10 MHz |
| -12 |
|
12.5 MHz |
| |
| |
2. Part number |
| 80286 |
|
80286 microprocessor |
| |
| |
|
1. Package type |
| A |
|
Ceramic PGA |
| C |
|
Ceramic LCC |
| CG |
|
Ceramic PGA |
| N |
|
Plastic LCC |
| R |
|
Ceramic LCC |
80287 identification
| 1 |
2 |
3 |
|
| C |
80287 |
-3 |
|
| |
| 3. Frequency |
| -3 |
|
5 MHz |
| -6 |
|
6 MHz |
| -8 |
|
8 MHz |
| -10 |
|
10 MHz |
| -12 |
|
12.5 MHz |
| |
| |
2. Part number |
| 80287 |
|
Co-processor for 80286 family of processors |
| |
| |
|
1. Package type |
| C |
|
Ceramic side-brazed DIP |
| D |
|
Ceramic DIP |
80386 and 80387 identification
| 1 |
2 |
3 |
4 |
|
5 |
|
| A |
80386 |
DX |
-33 |
|
IV |
|
| |
|
| 5. Manufacturing technology |
| Not specified |
|
CHMOS III |
| IV |
|
CHMOS IV |
| |
| |
|
4. Frequency |
| -16 |
|
16 MHz |
| -20 |
|
20 MHz |
| -25 |
|
25 MHz |
| -33 |
|
33 MHz |
| |
| |
|
|
3. Data bus width |
| Blank |
|
32-bit external data bus (same as DX) |
| DX |
|
32-bit external data bus |
| EX |
|
Embedded version of 80386 processor |
| SX |
|
16-bit external data bus |
| |
| |
|
|
|
2. Part number |
| 80386 |
|
80386 microprocessor |
| 80387 |
|
Co-processor for 80386 family of processors |
| |
| |
|
|
|
|
1. Package type |
| A |
|
Ceramic PGA |
| NG |
|
Plastic QFP |
80860 identification
| 1 |
2 |
|
3 |
|
| A |
80860XP |
- |
50 |
|
| |
|
| 3. Frequency (MHz) |
| 25 |
|
25 MHz |
| 33 |
|
33 MHz |
| 40 |
|
40 MHz |
| 50 |
|
50 MHz |
| |
| |
|
2. Part number |
| 80860XP |
|
Improved version of 80860 microprocessor with multiprocessor support |
| 80860XR |
|
80860 32-bit microprocessor |
| |
| |
|
|
1. Package type |
| A |
|
Staggered ceramic PGA |
80960 identification
| 1 |
2 |
3 |
4 |
|
5 |
|
| A |
80960 |
HT |
3V |
- |
133 |
|
| |
|
| 5. Frequency (MHz) |
| |
| |
|
4. Core voltage |
| 3V |
|
3.3V |
| |
| |
|
|
3. Processor features |
| CA |
|
Superscalar 32-bit processor |
| CF |
|
Superscalar 32-bit processor |
| HA |
|
High performance superscalar 32-bit processor |
| HD |
|
High performance superscalar 32-bit processor running at 2x bus speed |
| HT |
|
High performance superscalar 32-bit processor running at 3x bus speed |
| KA |
|
Cost-effective 32-bit processor |
| KB |
|
Cost-effective 32-bit processor |
| MC |
|
Cost-effective 32-bit processor |
| JA |
|
Low power 32-bit processor |
| JC |
|
Low power 32-bit processor running at 2x bus speed |
| JD |
|
Low power 32-bit processor |
| JF |
|
Low power 32-bit processor |
| JS |
|
Low power 32-bit processor |
| JT |
|
Low power 32-bit processor running at 3x bus speed |
| RD |
|
32-bit I/O processor |
| RM |
|
32-bit I/O processor |
| RN |
|
32-bit I/O processor |
| RP |
|
32-bit I/O processor |
| RS |
|
32-bit I/O processor |
| SA |
|
Cost-effective 32-bit processor |
| SB |
|
Cost-effective 32-bit processor |
| VH |
|
32-bit processor with integrated PCI interface |
| |
| |
|
|
|
2. Part number |
| 80960 |
|
80960 processor |
| |
| |
|
|
|
|
1. Package type |
| A |
|
Staggered ceramic PGA |
| FC |
|
Shrink QFP |
| FW |
|
324-ball PBGA |
| GD |
|
196-ball PBGA |
| KU |
|
Plastic QFP |
| N |
|
Plastic LCC |
| NG |
|
132-lead plastic QFP |
| S |
|
80-lead QFP |
| TA |
|
Staggered ceramic PGA (extended temperature) |
| TG |
|
Plastic QFP (extended temperature) |
| TN |
|
Plastic LCC (extended temperature) |
SA-110 identification
| 1 |
|
2 |
|
| SA-110 |
|
21281-EB |
|
| |
|
| 2. Frequency |
| 21281-AB |
|
160 MHz |
| 21281-BB |
|
100 MHz |
| 21281-CB |
|
200 MHz |
| 21281-DB |
|
166 MHz |
| 21281-EB |
|
233 MHz |
| 21281-FB |
|
233 MHz |
| |
| |
|
1. Part number |
| SA-110 |
|
SA-110 StrongArm processor |
|