Mostek identification

3870 | 3880 family, other 1xxx/2xxx/3xxx/4xxx RAM/ROM chips | 68000

  3870 identification  
Related links: 3870
  1   2 3 4   5 6  
MK 3870 / 2 2 P - 1 0  
       
6. Power supply tolerance
0    5 V ± 10%
5   5 V ± 5%
 
  5. Temperature range
0   Commercial range 0 - +70°C
1   Extended range -40 - +85°C
 
      4. Package type
N   Plastic DIP
P   Ceramic DIP
R   Ceramic piggyback DIP
 
        3. Executable RAM size
0   None
2   64 bytes
 
          2. ROM size
0   No internal ROM
1   1 KB
2   2 KB
3   3 KB
4   4 KB
 
              1. Part number
2870   28-pin version of MK3870
3870   Microcontroller with on-board RAM and ROM
38P70   EPROM version of MK3870 in piggyback package
3873   MK3870 microcontroller with serial input/output port
38P73   EPROM version of MK38P73 in piggyback package
3875   MK3870 microcontroller with low power standby mode
38P75   EPROM version of MK38P75 in piggyback package

  3880 family, other 1xxx/2xxx/3xxx/4xxx RAM/ROM chips identification  
Related links: Z80
  1 2 3   4 5  
MK B 3880 P - 8 0  
     
5. Access time/Frequency
No designation    Device dependent, 2.5 MHz for 3880
0   Device dependent, 2.5 MHz for 3880
4   Device dependent, 4 MHz for 3880
6   Device dependent, 6 MHz for 3880
 
  4. Temperature range
No designation   Commercial range 0 - +70°C
1   Extended range -40 - +85°C
2   Extended range -55 - +125°C
7   Industrial range -40 - +85°C
8   Military range (device dependent, usually -55 - +125°C)
 
      3. Package type
D   Dual density RAM-PAC
E   Leadless chip carrier
F   Flat package
J   Ceramic DIP
K   Tin side-brazed ceramic DIP
N   Plastic DIP
P   Ceramic side-brazed DIP
T   Ceramic DIP with transparent lid
 
        2. Part number
1xxx or 1xxxx   Shift register, ROM
2xxx or 2xxxx   ROM, EPROM
3xxx or 3xxxx   ROM, EPROM
3880   3880 (Z80) processor
38xx   Microprocessor components
4xxx or 4xxxx   RAM
5xxx or 5xxxx   Counters, Telecommunication and Industrial
7xxx or 7xxxx   Microcomputer systems
 
          1. Screening
No designation   Standard screening.
I   High Reliability screening. Temperature range (parameter 4) for these devices is 7.
B   MIL-STD-883 Level B screening. Temperature range (parameter 4) for these devices is 8.

  68000 identification  
Related links: 68000
  1 2 3   4  
MK B 68000 P - 10  
     
4. Frequency
4    4 MHz
6   6 MHz
8   8 MHz
10   10 MHz
 
    3. Package type
E   Leadless chip carrier
F   Flat package
J   Ceramic DIP
K   Tin side-brazed ceramic DIP
N   Plastic DIP
P   Ceramic side-brazed DIP
 
      2. Part number
68000   68000 CPU
 
        1. Screening
No designation   Standard screening.
B   MIL-STD-883 Level B screening. Temperature range (parameter 4) for these devices is 8.

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