Mostek identification
1xxx/2xxx/3xxx/4xxx RAM/ROM chips | 3870 | 3880 | 68000
1xxx/2xxx/3xxx/4xxx RAM/ROM chips identification
| | 1 | 2 | 3 | | 4 | 5 | |
| MK | I | 3881 | P | - | 7 | 0 | |
| |
| 5. Access time/Frequency |
| |
| | 4. Temperature range |
| No designation | Commercial range 0 - +70°C |
| 1 | Extended range -40 - +85°C |
| 2 | Extended range -55 - +125°C |
| 7 | Industrial range -40 - +85°C |
| 8 | Military range (device dependent, usually -55 - +125°C) |
| |
| | | | 3. Package type |
| D | Dual density RAM-PAC |
| E | Leadless chip carrier |
| F | Flat package |
| J | Ceramic DIP |
| K | Tin side-brazed ceramic DIP |
| N | Plastic DIP |
| P | Ceramic side-brazed DIP |
| T | Ceramic DIP with transparent lid |
| |
| | | | | 2. Part number |
| 1xxx or 1xxxx | Shift register, ROM |
| 2xxx or 2xxxx | ROM, EPROM |
| 3xxx or 3xxxx | ROM, EPROM |
| 38xx | Microprocessor components |
| 4xxx or 4xxxx | RAM |
| 5xxx or 5xxxx | Counters, Telecommunication and Industrial |
| 7xxx or 7xxxx | Microcomputer systems |
| |
| | | | | | 1. Screening |
| No designation | Standard screening. |
| I | High Reliability screening. These devices usually have industrial temperature range |
| B | MIL-STD-883 Level B screening. These devices usually have military temperature range |
3870 identification
| | 1 | | 2 | 3 | 4 | | 5 | 6 | |
| MK | 3870 | / | 2 | 2 | P | - | 1 | 0 | |
| |
| 6. Power supply tolerance |
| 0 | 5 V ± 10% |
| 5 | 5 V ± 5% |
| |
| | 5. Temperature range |
| 0 | Commercial range 0 - +70°C |
| 1 | Extended range -40 - +85°C |
| |
| | | | 4. Package type |
| N | Plastic DIP |
| P | Ceramic DIP |
| R | Ceramic piggyback DIP |
| |
| | | | | 3. Executable RAM size |
| 0 | None |
| 2 | 64 bytes |
| |
| | | | | | 2. ROM size |
| 0 | No internal ROM |
| 1 | 1 KB |
| 2 | 2 KB |
| 3 | 3 KB |
| 4 | 4 KB |
| |
| | | | | | | | 1. Part number |
| 2870 | 28-pin version of MK3870 |
| 3870 | Microcontroller with on-board RAM and ROM |
| 38P70 | EPROM version of MK3870 in piggyback package |
| 3873 | MK3870 microcontroller with serial input/output port |
| 38P73 | EPROM version of MK38P73 in piggyback package |
| 3875 | MK3870 microcontroller with low power standby mode |
| 38P75 | EPROM version of MK38P75 in piggyback package |
3880 identification
| | 1 | 2 | 3 | | 4 | 5 | |
| MK | B | 3880 | P | - | 8 | 0 | |
| |
| 5. Access time/Frequency |
| No designation | 2.5 MHz |
| 0 | 2.5 MHz |
| 4 | 4 MHz |
| 6 | 6 MHz |
| |
| | 4. Temperature range |
| No designation | Commercial range 0 - +70°C |
| 1 | Extended range -40 - +85°C |
| 2 | Extended range -55 - +125°C |
| 3 | Extended range -55 - +100°C |
| 7 | Industrial range -40 - +85°C |
| 8 | Military range -55 - +125°C |
| |
| | | | 3. Package type |
| J | Ceramic DIP |
| N | Plastic DIP |
| P | Ceramic side-brazed DIP |
| |
| | | | | 2. Part number |
| 3880 | 3880 (Z80) processor |
| |
| | | | | | 1. Screening |
| No designation | Standard screening. |
| I | High Reliability screening. These chips usually have industrial temperature range |
| B | MIL-STD-883 Level B screening. These chips usually have military temperature range |
68000 identification
| | 1 | 2 | 3 | | 4 | |
| MK | B | 68000 | P | - | 10 | |
| |
| 4. Frequency |
| 4 | 4 MHz |
| 6 | 6 MHz |
| 8 | 8 MHz |
| 10 | 10 MHz |
| |
| | | 3. Package type |
| E | Leadless chip carrier |
| F | Flat package |
| J | Ceramic DIP |
| K | Tin side-brazed ceramic DIP |
| N | Plastic DIP |
| P | Ceramic side-brazed DIP |
| |
| | | | 2. Part number |
| 68000 | 68000 CPU |
| |
| | | | | 1. Screening |
| No designation | Standard screening. |
| B | MIL-STD-883 Level B screening. Temperature range (parameter 4) for these devices is 8. |