Motorola identification

2901 | 6800 | 68HC11 | 68000, 68008 and 68010 | 68020, 68030, 68040, 68060, 68881 and 68882 | 88100 | PowerPC 603

	1	2	3
MC	2901	L	C
				3. Temperature range
				C	Commercial range 0 - +70°C
				M	Military range -55 - +125°C
				2. Package type
				F	Flat pack
				L	Ceramic side-brazed DIP
				P	Plastic DIP
				1. Part number
				2901	2901 bit slice processor
				2901A	2901A bit slice processor (faster version of 2901)
				2903	2903 bit-slice processor, enhanced verion of AMD 2901
				2909	Microprogram sequencer
				2910	Microprogram controller
				2911	Microprogram sequencer

	1	2	3	4	5	6
MC68		01	C	L	-1	DS
							6. Additional screening
							Blank	Normal screening
							D	Burn-in screening
							S	10 temperature cycles from -25°C to 150°C and high temperature testing
							DS	Burn-in screening, 10 temperature cycles from -25°C to 150°C and high temperature testing
							5. Frequency modifier
							Blank	Frequency is determined by parameter 1 (Frequency)
							-1	1.25 MHz
							4. Package type
							L	Ceramic side-brazed DIP
							P	Plastic DIP
							S	Ceramic DIP
							3. Temperature range
							Blank	Commercial range 0 - +70°C
							C	Extended range -40 - +85°C
							V	Extended range -40 - +105°C
							2. Part number
							00	6800 CPU
							01	Improved 6800 Microcontroller with RAM, ROM and peripherals
							02	Microcontroller with clock and RAM
							02NS	Microcontroller with clock and RAM (no standby RAM)
							03	Improved 6800 microcontroller with RAM and peripherals
							03E	Improved 6800 microcontroller with RAM, peripherals and external clock
							08	Microcontroller with clock
							09	Greatly enhanced version of 6800 processor with on-chip clock oscillator
							09E	Greatly enhanced version of 6800 processor with external clock oscillator
							1. Frequency
							Blank	1 MHz
							A	1.5 MHz
							B	2 MHz

1		2	3	4	5	6	7
MC	68HC	7	11E9		C	FS
								7. Frequency
								2	2 MHz
								3	3 MHz
								4	4 MHz
								6. Package type
								FB	Plastic QFP
								FN	plastic LCC
								FS	Ceramic LCC
								FU	Plastic QFP
								P	Plastic DIP
								PV	TQFP
								PU	TQFP
								PB	TQFP
								S	Ceramic DIP
								5. Temperature range
								Blank	Commercial range 0 - +70°C
								C	Extended range -40 - +85°C
								V	Extended range -40 - +105°C
								M	Military range -40 - +125°C
								4. Monitor mask
								Blank	None
								B	BUFFALO monitor/debugging program
								3. Part number
								2. ROM type
								Blank	Masked ROM or no ROM
								7	EPROM or OTPROM
								8	EEPROM
								1. Qualification level
								MC	Fully qualified parts
								XC	Pilot production device
								PC	Engineering sample

1	2	3	4	5	6
MC	68000	C	L	8	DS
						6. Additional screening
						Blank	Normal screening
						D	Burn-in screening
						S	10 temperature cycles from -25°C to 150°C and high temperature testing
						DS	Burn-in screening, 10 temperature cycles from -25°C to 150°C and high temperature testing
						T	100% high temperature functional test and dynamic burn-in at 125°C for 96 hours
						5. Frequency
						4	4 MHz
						6	6 MHz
						8	8 MHz
						10	10 MHz
						12	12.5 MHz
						12F	16.67 MHz
						16	16 MHz
						4. Package type
						L	Side-brazed ceramic DIP, solder lead finish
						LC	Side-brazed ceramic DIP, gold lead finish
						P	Plastic DIP
						R	Ceramic PGA, solder lead finish
						RC	Ceramic PGA, gold lead finish
						RP	Plastic PGA
						FN	Plastic LCC
						FU	Plastic Quad Flat Pack
						ZB	Ceramic LCC, suitable for socketing
						ZC	Ceramic LCC, suitable for surface mounting
						3. Temperature range
						Blank	Commercial range 0 - +70°C
						C	Extended range -40 - +85°C
						I	Extended range 0 - 85°C
						2. Part number
						68000	68000 microprocessor
						68EC000	68000 embedded CPU with statically selectable data bus width
						68HC000	Low power 68000 CPU
						68HC001	Low power 68000 CPU with statically selectable data bus width
						68008	68000 microprocessor with 8 bit data bus
						68010	enhanced version of 68000 CPU with virtual memory support
						68010	enhanced version of 68000 CPU with virtual memory support and 2 GB addressing range
						1. Qualification level
						MC	Fully qualified parts
						XC	Engineering sample

1	2	3	4	5
MC	68040	RC	25	B
					5. Processor revision
					4. Frequency
					16	16.67 MHz
					20	20 MHz
					25	25 MHz
					33	33 MHz
					40	40 MHz
					50	50 MHz
					60	60 MHz
					66	66 MHz
					75	75 MHz
					3. Package type
					RC	Ceramic PGA, gold lead finish
					RP	Plastic PGA
					FE	Quad Flat Pack (68040)
					2. Part number
					68020	68020 microprocessor
					68EC020	68000 embedded microprocessor with 24-bit data bus
					68030	68030 microprocessor
					68EC030	68030 embedded microprocessor without on-chip MMU
					68040	68040 microprocessor
					68040V	68040 static microprocessor without integrated co-processor
					68LC040	68040 microprocessor without integrated co-processor
					68EC040	68040 embedded microprocessor without integrated co-processor and memory management unit
					68EC040V	68040 static microprocessor without integrated co-processor and memory management unit
					68060	68060 superscalar microprocessor
					68LC060	68060 low-cost microprocessor without FPU
					68EC060	68060 embedded microprocessor without FPU and MMU
					68881	68881 floating-point unit for 68000 family of processors
					68882	Enhanced version of 68881 co-processor
					1. Qualification level
					MC	Fully qualified parts
					XC	Pilot production device
					PC	Engineering sample

1	2	3	4
MC	88100	RC	25
				4. Frequency
				20	20 MHz
				25	25 MHz
				3. Package type
				RC	Ceramic PGA
				2. Part number
				88100	88100 microprocessor
				1. Qualification level
				MC	Fully qualified parts
				XC	Pilot production device
				PC	Engineering sample

1	2	3	4	5	6	7	8
X	PC	603	P	RX	180	L	E
								8. Revision
								7. Specification modifier
								A	Processor runs at bus speed
								C	Processor runs at 2x bus speed
								D	Processor runs at 5/2 of bus speed
								L	Full specification
								R	Maximum temperature 105°C
								T	Extended temperature range
								6. Frequency (MHz)
								5. Package type
								FE	Wire-bond ceramic QFP
								PX	Plastic BGA without lid
								RX	Ceramic BGA without lid
								ZT	Plastic BGA with lid
								4. Part modification
								A	Original design
								B	DGO process
								E	3.3V core voltage, 0.5 micron 4-layer metal CMOS process
								P	2.5V core voltage, 0.35 micron 5-layer metal CMOS process
								R	2.5V core voltage, 0.29 micron 5-layer metal CMOS process
								3. Part number
								603	PowerPC 603 microprocessor
								2. Market
								PC	Desktop processor
								PE	Embedded processor
								1. Qualification level
								M	Fully qualified part
								X	Not fully qualified part
								P	Engineering sample