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Motorola identification


2901 | 6800 | 68HC11 | 68000, 68008 and 68010 | 68020, 68030, 68040, 68060, 68881 and 68882 | 88100 | PowerPC 603

  2901 identification  
Related links: 2901
  1 2 3  
MC 2901 L C  
   
3. Temperature range
C    Commercial range 0 - +70°C
M   Military range -55 - +125°C
 
  2. Package type
F   Flat pack
L   Ceramic side-brazed DIP
P   Plastic DIP
 
    1. Part number
2901   2901 bit slice processor
2901A   2901A bit slice processor (faster version of 2901)
2903   2903 bit-slice processor, enhanced verion of AMD 2901
2909   Microprogram sequencer
2910   Microprogram controller
2911   Microprogram sequencer

  6800 identification  
Related links: 680x
  1 2 3 4 5 6  
MC68   01 C L -1 DS  
   
6. Additional screening
Blank    Normal screening
D   Burn-in screening
S   10 temperature cycles from -25°C to 150°C and high temperature testing
DS   Burn-in screening, 10 temperature cycles from -25°C to 150°C and
high temperature testing
 
  5. Frequency modifier
Blank   Frequency is determined by parameter 1 (Frequency)
-1   1.25 MHz
 
    4. Package type
L   Ceramic side-brazed DIP
P   Plastic DIP
S   Ceramic DIP
 
      3. Temperature range
Blank   Commercial range 0 - +70°C
C   Extended range -40 - +85°C
V   Extended range -40 - +105°C
 
        2. Part number
00   6800 CPU
01   Improved 6800 Microcontroller with RAM, ROM and peripherals
02   Microcontroller with clock and RAM
02NS   Microcontroller with clock and RAM (no standby RAM)
03   Improved 6800 microcontroller with RAM and peripherals
03E   Improved 6800 microcontroller with RAM, peripherals and external clock
08   Microcontroller with clock
09   Greatly enhanced version of 6800 processor with on-chip clock oscillator
09E   Greatly enhanced version of 6800 processor with external clock oscillator
 
          1. Frequency
Blank   1 MHz
A   1.5 MHz
B   2 MHz

  68HC11 identification  
Related links: 680x
1   2 3 4 5 6 7  
MC 68HC 7 11E9   C FS    
   
7. Frequency
2    2 MHz
3   3 MHz
4   4 MHz
 
  6. Package type
FB   Plastic QFP
FN   plastic LCC
FS   Ceramic LCC
FU   Plastic QFP
P   Plastic DIP
PV   TQFP
PU   TQFP
PB   TQFP
S   Ceramic DIP
 
    5. Temperature range
Blank   Commercial range 0 - +70°C
C   Extended range -40 - +85°C
V   Extended range -40 - +105°C
M   Military range -40 - +125°C
 
      4. Monitor mask
Blank   None
B   BUFFALO monitor/debugging program
 
  3. Part number
 
          2. ROM type
Blank   Masked ROM or no ROM
7   EPROM or OTPROM
8   EEPROM
 
              1. Qualification level
MC   Fully qualified parts
XC   Pilot production device
PC   Engineering sample

  68000, 68008 and 68010 identification  
Related links: 68000 | 68008 | 68010
1 2 3 4 5 6  
MC 68000 C L 8 DS  
 
6. Additional screening
Blank    Normal screening
D   Burn-in screening
S   10 temperature cycles from -25°C to 150°C and high temperature testing
DS   Burn-in screening, 10 temperature cycles from -25°C to 150°C and high temperature testing
T   100% high temperature functional test and dynamic burn-in at 125°C for 96 hours
 
  5. Frequency
4   4 MHz
6   6 MHz
8   8 MHz
10   10 MHz
12   12.5 MHz
12F   16.67 MHz
16   16 MHz
 
    4. Package type
L   Side-brazed ceramic DIP, solder lead finish
LC   Side-brazed ceramic DIP, gold lead finish
P   Plastic DIP
R   Ceramic PGA, solder lead finish
RC   Ceramic PGA, gold lead finish
RP   Plastic PGA
FN   Plastic LCC
FU   Plastic Quad Flat Pack
ZB   Ceramic LCC, suitable for socketing
ZC   Ceramic LCC, suitable for surface mounting
 
      3. Temperature range
Blank   Commercial range 0 - +70°C
C   Extended range -40 - +85°C
I   Extended range 0 - 85°C
 
        2. Part number
68000   68000 microprocessor
68EC000   68000 embedded CPU with statically selectable data bus width
68HC000   Low power 68000 CPU
68HC001   Low power 68000 CPU with statically selectable data bus width
68008   68000 microprocessor with 8 bit data bus
68010   enhanced version of 68000 CPU with virtual memory support
68010   enhanced version of 68000 CPU with virtual memory support and 2 GB addressing range
 
          1. Qualification level
MC   Fully qualified parts
XC   Engineering sample

  68020, 68030, 68040, 68060, 68881 and 68882 identification  
Related links: 68020 | 68030 | 68040 | 68060 | 68881 | 68882
1 2 3 4 5  
MC 68040 RC 25 B  
 
5. Processor revision
 
  4. Frequency
16    16.67 MHz
20   20 MHz
25   25 MHz
33   33 MHz
40   40 MHz
50   50 MHz
60   60 MHz
66   66 MHz
75   75 MHz
 
    3. Package type
RC   Ceramic PGA, gold lead finish
RP   Plastic PGA
FE   Quad Flat Pack (68040)
 
      2. Part number
68020   68020 microprocessor
68EC020   68000 embedded microprocessor with 24-bit data bus
68030   68030 microprocessor
68EC030   68030 embedded microprocessor without on-chip MMU
68040   68040 microprocessor
68040V   68040 static microprocessor without integrated co-processor
68LC040   68040 microprocessor without integrated co-processor
68EC040   68040 embedded microprocessor without integrated co-processor and memory management unit
68EC040V   68040 static microprocessor without integrated co-processor and memory management unit
68060   68060 superscalar microprocessor
68LC060   68060 low-cost microprocessor without FPU
68EC060   68060 embedded microprocessor without FPU and MMU
68881   68881 floating-point unit for 68000 family of processors
68882   Enhanced version of 68881 co-processor
 
        1. Qualification level
MC   Fully qualified parts
XC   Pilot production device
PC   Engineering sample

  88100 identification  
1 2 3 4  
MC 88100 RC 25  
 
4. Frequency
20    20 MHz
25   25 MHz
 
  3. Package type
RC   Ceramic PGA
 
    2. Part number
88100   88100 microprocessor
 
      1. Qualification level
MC   Fully qualified parts
XC   Pilot production device
PC   Engineering sample

  PowerPC 603 identification  
Related links: PowerPC-603
1 2 3 4 5 6 7  
XPC 603 P RX 180 L E  
 
7. Revision
 
  6. Specification modifier
A    Processor runs at bus speed
C   Processor runs at 2x bus speed
L   Full specification
T   Extended temperature range
 
  5. Frequency (MHz)
 
      4. Package type
FE   Wire-bond ceramic QFP
RX   Ceramic BGA without lid
ZT   Plastic BGA with lid
 
        3. Part modification
A   Original design
E   3.3V core voltage, 0.5 micron 4-layer metal CMOS process
P   2.5V core voltage, 0.35 micron 5-layer metal CMOS process
R   2.5V core voltage, 0.29 micron 5-layer metal CMOS process
 
          2. Part number
603   PowerPC 603 microprocessor
 
            1. Qualification level
MPC   Fully qualified part
XPC   Not fully qualified part
PPC   Engineering sample

Last modified: 3 Aug 2008
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