 |
News · Chips · Information · Forum · Links · About |
|---|---|
| Identification · Pinouts · S-Spec numbers · Glossary | |
National Semiconductor identification
2901 | 4004 | SC/MP and SC/MP II | SC/MP II | 32000 | COP400 | NSC800 | MCS-48 | 8080 | Geode GX1 | Geode GXm
2901 identification
Related links: 2901
| 1 | 2 | 3 | 4 | 5 | |||
| IDM | 2901A | -1 | D | M | /883 | ||
| 5. Screening | |||||||
| Blank | Standard screening | ||||||
| /883 | MIL-STD-883 class B | ||||||
| 4. Temperature range | |||||||
| C | Commercial range 0 - +70°C | ||||||
| M | Military range -55 - +125°C | ||||||
| 3. Package type | |||||||
| D | Side-brazed ceramic DIP | ||||||
| J | Ceramic DIP | ||||||
| N | Plastic DIP | ||||||
| 2. Frequency | |||||||
| Blank | 16 MHz for commerical or 13 MHz for military devices (2901A), 12 MHz (2903A) | ||||||
| -1 | 18 MHz for commerical or 15 MHz for military devices (2901A) | ||||||
| -2 | 22 MHz for commerical or 16 MHz for military devices (2901A) | ||||||
| 1. Part number | |||||||
| 2901A | 4-bit bipolar microprocessor | ||||||
| 2903A | Enhanced version of 2901 4-bit bipolar microprocessor | ||||||
4004 identification
Related links: 4004
| 1 | 2 | |||
| INS | 4004 | D | ||
| 2. Package type | ||||
| D | Ceramic side-brazed DIP | |||
| J | Ceramic DIP | |||
| N | Plastic DIP | |||
| 1. Part number | ||||
| 4004 | 4004 microprocessor | |||
SC/MP and SC/MP II identification
| 1 | 2 | |||
| ISP-8A/ | 600 | D | ||
| 2. Package type | ||||
| D | Ceramic side-brazed DIP | |||
| N | Plastic DIP | |||
| 1. Part number | ||||
| 500 | SC/MP microprocessor | |||
| 600 | SC/MP II microprocessor | |||
SC/MP II identification
Related links: SC/MP II
| 1 | 2 | |||
| INS | 8060 | N | ||
| 2. Package type | ||||
| D | Ceramic side-brazed DIP | |||
| N | Plastic DIP | |||
| 1. Part number | ||||
| 8060 | SC/MP II microprocessor | |||
32000 identification
| 1 | 2 | 3 | ||||
| NS | 32081 | D | - | 8 | ||
| 3. Frequency | ||||||
| 6 | 6 MHz | |||||
| 8 | 8 MHz | |||||
| 10 | 10MHz | |||||
| 2. Package type | ||||||
| D | Ceramic side-brazed DIP | |||||
| N | Plastic DIP | |||||
| 1. Part number | ||||||
| 08032 | 32000 microprocessor with 8-bit data bus (old naming convention) | |||||
| 16032 | 32000 microprocessor with 16-bit data bus (old naming convention) | |||||
| 16C032 | CMOS version of 32000 microprocessor with 16-bit data bus (old naming convention) | |||||
| 32008 | 32000 microprocessor with 8-bit data bus | |||||
| 32016 | 32000 microprocessor with 16-bit data bus | |||||
| 32C016 | CMOS version of 32000 microprocessor with 16-bit data bus | |||||
| 32032 | 32000 microprocessor with 32-bit data bus | |||||
| 32081 | Floating Point Unit for 32000 family of processors | |||||
COP400 identification
| 1 | 2 | 3 | 4 | 5 | |||||
| COP | 4 | 00 | C | - | XXX | / | N | ||
| 5. Package type | |||||||||
| D | Side-brazed ceramic DIP | ||||||||
| N | Plastic DIP | ||||||||
| V | Plastic LCC | ||||||||
| WM | Flat pack (wide body) | ||||||||
| 4. ROM code | |||||||||
| 3. Manufacturing technology | |||||||||
| Blank | NMOS hi-speed | ||||||||
| C | CMOS | ||||||||
| CH | CMOS | ||||||||
| L | NMOS low power | ||||||||
| 2. Part number | |||||||||
| 10 | 512 bytes ROM, 32 bytes RAM, 19 I/O pins, no interrupts, 2-level stack | ||||||||
| 11 | 512 bytes ROM, 32 bytes RAM, 16 I/O pins, no interrupts, 2-level stack | ||||||||
| 13 | 512 bytes ROM, 32 bytes RAM, 15 I/O pins, no interrupts, 2-level stack | ||||||||
| 14 | 512 bytes ROM, 32 bytes RAM, 15 I/O pins, no interrupts, 2-level stack | ||||||||
| 20 | 1 KB ROM, 64 bytes RAM, 23 I/O pins, interrupts, 3-level stack, time counter | ||||||||
| 21 | 1 KB ROM, 64 bytes RAM, 19 I/O pins, no interrupts, 3-level stack, time counter | ||||||||
| 22 | 1 KB ROM, 64 bytes RAM, 16 I/O pins, no interrupts, 3-level stack, time counter | ||||||||
| 24 | 1 KB ROM, 64 bytes RAM, 23 I/O pins, interrupts, 3-level stack, time counter | ||||||||
| 25 | 1 KB ROM, 64 bytes RAM, 19 I/O pins, no interrupts, 3-level stack, time counter | ||||||||
| 26 | 1 KB ROM, 64 bytes RAM, 16 I/O pins, no interrupts, 3-level stack, time counter | ||||||||
| 40 | 2 KB ROM, 160 bytes RAM, 35 I/O pins, interrupts, 4-level stack, time counter | ||||||||
| 41 | 2 KB ROM, 160 bytes RAM, 23 I/O pins, interrupts, 4-level stack, time counter | ||||||||
| 42 | 2 KB ROM, 160 bytes RAM, 19 I/O pins, interrupts, 2-level stack, time counter | ||||||||
| 44 | 2 KB ROM, 128 bytes RAM, 23 I/O pins, interrupts, 3-level stack, time counter | ||||||||
| 45 | 2 KB ROM, 128 bytes RAM, 19 I/O pins, no interrupts, 3-level stack, time counter | ||||||||
| 1. Operating temperature range | |||||||||
| 2 | Military range -55 - +125°C | ||||||||
| 3 | Industrial range -40 - +85°C | ||||||||
| 4 | Commercial range 0 - +70°C | ||||||||
NSC800 identification
Related links: NSC800
| 1 | 2 | 3 | 4 | 5 | |||
| NSC | 800 | D | -1 | I | /A+ | ||
| 5. Screening | |||||||
| Blank | Standard screening | ||||||
| /A+ | A + reliability screening | ||||||
| /883 | MIL-STD-883 class B screening | ||||||
| 4. Temperature range | |||||||
| Blank | Commercial range 0 - +70°C | ||||||
| I | Industrial range -40 - +85°C | ||||||
| MIL | Special range -55 - +90°C | ||||||
| M | Military range -55 - +125°C | ||||||
| 3. Frequency | |||||||
| Blank | 2.5 MHz | ||||||
| -1 | 1 MHz | ||||||
| -3 | 2.5 MHz | ||||||
| -35 | 3.5 MHz | ||||||
| -4 | 4 MHz | ||||||
| 2. Package type | |||||||
| D | Side-brazed ceramic DIP | ||||||
| E | Ceramic LCC | ||||||
| J | Ceramic DIP | ||||||
| N | Plastic DIP | ||||||
| V | Plastic LCC | ||||||
| 1. Part number | |||||||
| 800 | 800 CPU | ||||||
MCS-48 identification
| 1 | 2 | 3 | ||||
| INS | 8048 | N | - | 6 | ||
| 3. Frequency | ||||||
| 6 | 6 MHz | |||||
| 11 | 11 MHz | |||||
| 2. Package type | ||||||
| J | Ceramic DIP | |||||
| N | Plastic DIP | |||||
| 1. Part number | ||||||
| 8035 | 8048-compatible microcontroller with 64 bytes of RAM and without ROM | |||||
| 8039 | 8048-compatible microcontroller with 128 bytes of RAM and without ROM | |||||
| 8040 | 8048-compatible microcontroller with 256 bytes of RAM and without ROM | |||||
| 8048 | 8048 microcontroller with 64 bytes of RAM and 1 KB masked ROM | |||||
| 8049 | 8048-compatible microcontroller with 128 bytes of RAM and 2 KB masked ROM | |||||
| 8050 | 8048-compatible microcontroller with 256 bytes of RAM and 4 KB masked ROM | |||||
8080 identification
Related links: 8080
| 1 | 2 | 3 | 4 | 5 | |||
| INS | 8080A | D | I | -2 | /883 | ||
| 5. Screening | |||||||
| Blank | Standard screening | ||||||
| /883 | MIL-STD-883 class B screening | ||||||
| 4. Frequency (8080A part) | |||||||
| Blank | 2 MHz | ||||||
| -1 | 3.1 MHz | ||||||
| -2 | 2.6 MHz | ||||||
| 3. Temperature range | |||||||
| Blank | Commercial range 0 - +70°C | ||||||
| I | Industrial range -40 - +85°C | ||||||
| 2. Package type | |||||||
| D | Ceramic side-brazed DIP | ||||||
| J | Ceramic DIP | ||||||
| N | Plastic DIP | ||||||
| 1. Part number | |||||||
| 8080A | 8080A CPU | ||||||
Geode GX1 identification
| To identify National Semiconductor Geode GX1 CPU use the part number printed on the chip. The part number contains such information as processor speed, package type, core voltage and maximum case temperature. See the table below for interpretation of that number. |
|
Related links: GX1
| 1 | 2 | 3 | 4 | 5 | |||||
| GX1 | - | 200 | P | - | 85 | - | 2.0 | ||
| 5. Core voltage | |||||||||
| 1.6 | 1.6V | ||||||||
| 1.8 | 1.8V | ||||||||
| 2.0 | 2.0V | ||||||||
| 4. Temperature range | |||||||||
| 85 | 85 °C | ||||||||
| 3. Package type | |||||||||
| B | BGA | ||||||||
| P | Staggered Ceramic PGA | ||||||||
| 2. Frequency | |||||||||
| 200 | 200 MHz | ||||||||
| 233 | 233 MHz | ||||||||
| 266 | 266 MHz | ||||||||
| 300 | 300 MHz | ||||||||
| 1. Microprocessor family | |||||||||
| GX1 | GX1 processor | ||||||||
Geode GXm identification
| To identify National Semiconductor GXm processor use the part number printed on the chip. The part number contains such information as processor speed, package type, core voltage and maximum case temperature. The table below explains how to decode the part number. Another way to identify Geode GXm processor is to use the order number, also printed on the chip. Please see a list of Geode order numbers to find out part number and other major microprocessor parameters from the order number. |
|
Related links: MediaGX
| 1 | 2 | 3 | 4 | |||||
| GXm- | 233 | G | 2.9V | 70C | ||||
| 4. Maximum operating temperature | ||||||||
| 70C | 70°C | |||||||
| 85C | 85°C | |||||||
| 3. Core voltage | ||||||||
| 2.9V | 2.9 V | |||||||
| 2. Package type | ||||||||
| P | Ceramic PGA | |||||||
| B | BGA | |||||||
| 1. Frequency | ||||||||
| 180 | 180 MHz | |||||||
| 200 | 200 Mhz | |||||||
| 233 | 233 MHz | |||||||
| 266 | 266 MHz | |||||||
| Terms and Conditions · Privacy Policy · Contact Us | (c) Copyright 2003 - 2010 Gennadiy Shvets |