SGS identification
Z8 | Z80 (Z8400) | Z80L (Z8400L) | Z800x
Z8 identification
| | 1 | 2 | 3 | |
| Z | 8601 | B | 1 | |
| |
| 3. Temperature range |
| 1 | Commercial range 0 - +70°C |
| 6 | Extended range -40 - +85°C |
| |
| | 2. Package type |
| B | Plastic DIP |
| D | Ceramic side-brazed DIP |
| |
| | | 1. Part number |
| 8601 | Z8 microcontroller with 2 KB ROM |
| 8611 | Z8 microcontroller with 4 KB ROM |
| 8681 | Z8 microcontroller (ROMless) |
Z80 (Z8400) identification
| | 1 | 2 | 3 | 4 | |
| Z | 8400 | A | B | 1 | |
| |
| 4. Temperature range |
| 1 | Commercial range 0 - +70°C |
| 2 | Extended range -40 - +85°C |
| 6 | Extended range -55 - +125°C |
| |
| | 3. Package type |
| B | Plastic DIP |
| C | Plastic LCC |
| D | Ceramic side-brazed DIP |
| F | Ceramic DIP |
| K | Ceramic LCC |
| |
| | | 2. Frequency |
| Blank | 2.5 MHz |
| A | 4 MHz |
| B | 6 MHz |
| H | 8 MHz |
| |
| | | | 1. Part number |
| 8400 | Z80 CPU |
| 84C00 | Z80 CMOS CPU |
Z80L (Z8400L) identification
| | 1 | 2 | 3 | 4 | |
| Z | 8400L | 1 | B | 1 | |
| |
| 4. Temperature range |
| 1 | Commercial range 0 - +70°C |
| |
| | 3. Package type |
| B | Plastic DIP |
| D | Ceramic side-brazed DIP |
| F | Ceramic DIP |
| |
| | | 2. Frequency |
| 1 | 1 MHz |
| 2 | 1.5 MHz |
| 3 | 2.5 MHz |
| |
| | 1. Part number |
Z800x identification
| | 1 | 2 | 3 | 4 | |
| Z | 8001 | A | B | 1 | |
| |
| 4. Temperature range |
| 1 | Commercial range 0 - +70°C |
| 2 | Extended range -40 - +85°C |
| 6 | Extended range -55 - +125°C |
| |
| | 3. Package type |
| B | Plastic DIP |
| D | Ceramic side-brazed DIP |
| |
| | | 2. Frequency |
| Blank | 4 MHz |
| A | 6 MHz |
| B | 10 MHz |
| |
| | | | 1. Part number |
| 8001 | Segmented CPU |
| 8002 | Non-segmented CPU |
| 8003 | Segmented Virtual Memory Processing Unit |
| 8004 | Non-segmented Virtual Memory Processing Unit |