General naming convention identification
| 1 |
2 |
3 |
4 |
5 |
|
| CX |
A |
1003 |
A |
M |
|
| |
| 5. Package type |
| D |
|
Ceramic DIP |
| L |
|
Single inline package |
| M |
|
Mini flat package |
| P |
|
Plastic DIP |
| Q |
|
Quad inline package |
| S |
|
Shrink dual inline package |
| |
| |
4. Part modification |
| Blank |
|
Standard specifications |
| A |
|
Improved specifications |
| |
| |
3. Part number |
| |
| |
|
|
2. Device type |
| A |
|
Bipolar IC |
| B |
|
Bipolar digital IC |
| D |
|
MOS logic IC |
| K |
|
Memory |
| L |
|
CCD signal processor |
| P |
|
Microcomputer IC |
| Q |
|
Microcomputer IC |
| |
| |
1. Sony IC prefix |
V20 and V30 identification
| 1 |
2 |
3 |
4 |
5 |
|
| CX |
Q |
70108 |
D |
-8 |
|
| |
| 5. Frequency |
| -5 |
|
5 MHz |
| -8 |
|
8 MHz |
| |
| |
4. Package type |
| D |
|
Ceramic DIP |
| P |
|
Plastic DIP |
| |
| |
|
3. Part number |
| 70108 |
|
V20 microprocessor |
| 70116 |
|
V30 microprocessor |
| |
| |
|
|
2. Device type |
| Q |
|
Microcomputer IC |
| |
| |
1. Sony IC prefix |
| 