Sony identification
General naming convention | V20 and V30
General naming convention identification
| 1 | 2 | 3 | 4 | 5 | |
| CX | A | 1003 | A | M | |
| |
| 5. Package type |
| D | Ceramic DIP |
| L | Single inline package |
| M | Mini flat package |
| P | Plastic DIP |
| Q | Quad inline package |
| S | Shrink dual inline package |
| |
| | 4. Part modification |
| Blank | Standard specifications |
| A | Improved specifications |
| |
| | 3. Part number |
| |
| | | | 2. Device type |
| A | Bipolar IC |
| B | Bipolar digital IC |
| D | MOS logic IC |
| K | Memory |
| L | CCD signal processor |
| P | Microcomputer IC |
| Q | Microcomputer IC |
| |
| | 1. Sony IC prefix |
V20 and V30 identification
| 1 | 2 | 3 | 4 | 5 | |
| CX | Q | 70108 | D | -8 | |
| |
| 5. Frequency |
| -5 | 5 MHz |
| -8 | 8 MHz |
| |
| | 4. Package type |
| D | Ceramic DIP |
| P | Plastic DIP |
| |
| | | 3. Part number |
| 70108 | V20 microprocessor |
| 70116 | V30 microprocessor |
| |
| | | | 2. Device type |
| Q | Microcomputer IC |
| |
| | 1. Sony IC prefix |
