| 1 |
|
2 |
3 |
4 |
5 |
6 |
7 |
8 |
9 |
|
| TMS |
7 |
0 |
C |
|
4 |
2 |
N |
L |
|
|
| |
|
| 9. External clock divide-by option |
| Blank |
|
External clock is not divided |
| -2 |
|
External clock is divided by 2 |
| -4 |
|
External clock is divided by 4 |
| |
| |
8. Operating temperature |
| A |
|
Industrial range -40 - +85°C |
| H |
|
0 - 55°C |
| L |
|
Commercial range 0 - 70°C |
| |
| |
|
7. Package type |
| FN |
|
44-pin plastic LCC |
| JD |
|
40-pin ceramic side-brazed DIP |
| N |
|
40-pin plastic DIP |
| |
| |
|
|
6. RAM size and extra features |
| 0 |
|
128 bytes RAM |
| 1 |
|
128 bytes RAM, serial port |
| 2 |
|
256 bytes RAM, serial port |
| |
| |
|
|
|
5. ROM size |
| 0 |
|
0K (ROM-less) |
| 2 |
|
2K |
| 4 |
|
4K |
| 8 |
|
8K |
| |
| |
|
|
|
|
4. Package variation |
| Blank |
|
Standard |
| P |
|
Piggyback package |
| |
| |
|
|
|
|
|
3. Manufacturing technology |
| Blank |
|
NMOS |
| C |
|
CMOS |
| |
| |
|
|
|
|
|
|
2. ROM type |
| 0 |
|
Masked ROM or ROM-less |
| 7 |
|
EPROM |
| |
| |
|
|
|
|
|
|
|
|
1. Qualification level |
| TMX |
|
Prototype part |
| TMP |
|
Not fully-qualified part. Only electrical characteristics were verified, but not quality and reliability. |
| TMS |
|
Fully qualified part |
